PPT-1 Exploiting 3D-Stacked Memory Devices

Author : trish-goza | Published Date : 2017-04-03

Rajeev Balasubramonian School of Computing University of Utah Oct 2012 2 Power Contributions PERCENTAGE OF TOTAL SERVER POWER PROCESSOR MEMORY 3 Power Contributions

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1 Exploiting 3D-Stacked Memory Devices: Transcript


Rajeev Balasubramonian School of Computing University of Utah Oct 2012 2 Power Contributions PERCENTAGE OF TOTAL SERVER POWER PROCESSOR MEMORY 3 Power Contributions PERCENTAGE OF TOTAL. Input Devices M M e e m m o o r r y y P P r r o o g g r r a a m m & & D D a a t t a a Output Devices D D S S P P P P r r o o c c e e s s s s o o r r i i n n t t e e r r f f a a c c e e i i n n t t e e I/O Hardware. Application I/O Interface. Kernel I/O Subsystem. Transforming I/O Requests to Hardware Operations. I/O Hardware. Incredible variety of I/O devices. Common concepts. Port . Bus. (. daisy chain . Smart . Colocation. in Virtualized Data Centers. Written by. :. Timothy Wood, . Gabriel . Tarasuk. -Levin, . Prashant. . Shenoy. ,. Peter . Desnoyers. , . Emmanuel . Cecchet. , . Mark D. Corner. Presenter. for 3D memory systems. CAMEO. 12/15/2014 MICRO. Cambridge, UK. Chiachen Chou, Georgia Tech. Aamer. . Jaleel. , Intel. Moinuddin. K. . Qureshi. , Georgia Tech. Executive Summary. How to use . S. tacked DRAM: Cache or Memory. Amazingly enough there always seems to be somebody who is keen and able to fill the gaps in knowledge created by such developments, or who for some or other reason, is Jaewoong. . Sim. *, Gabriel H. Loh. +. , Vilas Sridharan. #. , Mike O’Connor. +. June . 2013 . *Georgia Tech. +. AMD Research. #. AMD RAS Architecture. Die-stacked Memory. Die-stacking is coming along, esp. DRAM. Chapter 5 Storing data of . norton. book. Chapter 6 of . capron. and . johnson. book. Three major types of storage devices. . magnetic page 174 of Norton book . Optical. Page 183 . norton. Solid state page 189 . Prof. Sokol. Computer and Information Science. Brooklyn College. 2. What is a Computer?. A . COMPUTER. is an electronic device that can:. Receive information. Perform processes. Produce output. Store info for future use.. CprE 381 Computer Organization and Assembly Level Programming, Fall 2013. Zhao Zhang. Iowa State University. Revised from original slides provided . by MKP. Chapter 5 — Large and Fast: Exploiting Memory Hierarchy — . University. . Advising. Services. Memory and Concentration. Memory. Knowledge. Concentration. Managing Memory. Mneumonic Devices. Effeciency. Memory. Sensory memory . Short-term memory . Long-term memory . Lecture for CPSC 5155. Edward Bosworth, Ph.D.. Computer Science Department. Columbus State University. The Simple View of Memory. The simplest view of memory is . that presented . at the ISA (Instruction Set Architecture) level. At this level, memory is a . . Circuit . board: . Motherboard . or system board. :. All devices must connect . ________________. External devices . ______________. Wireless . devices . connect _________________. 2. The CPU. Central processing unit (CPU): . Chapter 5 — Large and Fast: Exploiting Memory Hierarchy — . 2. Memory Technology. Static RAM (SRAM). 0.5ns – 2.5ns, $2000 – $5000 per GB. Dynamic RAM (DRAM). 50ns – 70ns, $20 – $75 per GB. The memory unit . supports . two fundamental operations: Read and . Write. . The . read operation read . a previously stored . data . and . the write operation stores . a . value . in memory. See .

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