PDF-The future technology for NAND flash

Copyright. reserves the right to change products or specifications without notice tn2942nandwearlevelingfm Rev A 1008 EN 2008 Micron Technology Inc All rights reserved Products and specifications disc ussed herein are for evaluation and reference purposes onl @ Micron.com. Flash Memory Technology Direction . Jim Cooke. Director of Applications Engineering. Memory Products Group. Micron Technology, Inc.. Agenda . Mass Storage . HDD, HHD, SSD. How Flash can Benefit Drives. Contact Information. Wesley Brown. wes@planetarydb.com. Twitter @. WesBrownSQL. Blog . http://www.sqlserverio.com. Today’s Topic Covers…. NAND Flash Structure. MLC and SLC Compared. NAND Flash Read Properties. Flash Serial NOR Flash SLC NAND Flash Spansion Nikhil Nichani. Francis Perez. Business Summary. Micron Technology, based in Boise, Idaho, engages in manufacturing and marketing of semiconductor devices worldwide. The company’s product line include Dynamic Random Access Memory(DRAM), Solid-State Drive(SSD), and Flash Memory(NAND and NOR). Micron’s products are used in many electronic applications such as personal computers, memory cards, mobile phones, USB storage devices, digital cameras, and MP3 players. Micron has assembling facilities in the United States, Asia, Middle-East, and Europe, and is a major player in the international markets with strong sales in China. In May, 2010, Micron completed the acquisition of . Embedded Systems . Chanik. Park, . Jaeyu. . Seo. , . Dongyoung. . Seo. , . Shinhan. Kim and . Bumsoo. Kim . Software Center, SAMSUNG Electronics, Co., Ltd. . Proceedings of the 21st International Conference on Computer . of A . 45nm SLC 3D NAND Flash . CPLD. Arijit Banerjee and Sergiu Mosanu. Date: 5/15/2015. Device scaling has reached molecular dimensions. 2D Moore’s law is about to end. 3D can be an option to further device scaling. Experimental Analysis, Exploits, and Mitigation Techniques. HPCA Session 3A – Monday, 3:15 . pm. , Salon F. 128GB. NAND . Flash. 256GB. NAND Flash. NAND flash scaling: . shrink size. . of each . flash cell, . Memory: Characterization. , Optimization, and . Recovery. Yixin Luo. yixinluo@cmu.edu. (joint work with Yu Cai, . Erich . F. Haratsch, Ken Mai, Onur Mutlu). 1. Presented in the best paper session at HPCA 2015. Exploiting Self-Recovery and Temperature Awareness. Yixin Luo. Saugata Ghose Yu Cai Erich F. Haratsch Onur Mutlu. HeatWatch. Storage Technology Drivers - 2018. 2. Store . large amounts . Abstract:. 3-D ICs are particularly suited for combinations of memory with other memory or logic devices. With the integration of Through Silicon . Viasing. (TSV) for chip to chip interconnects, microelectronics manufacturers are now implementing 3-Dimensional chip stacking to improve performance, bandwidth, power, weight, and storage. . Thesis Oral. Yixin Luo. Committee:. Onur Mutlu (Chair) . Phillip B. Gibbons. James C. Hoe. Erich F. Haratsch, Seagate. Yu Cai, SK Hynix. Presented in partial fulfilment of the requirements for the degree of Doctor of Philosophy. Jim Cooke. Director of Applications Engineering. Memory Products Group. Micron Technology, Inc.. Agenda . Mass Storage . HDD, HHD, SSD. How Flash can Benefit Drives. Hybrid, . ReadyBoost. , Robson, SSD. Vinod Ganapathy . Material drawn from the OSTEP book. 1. What are flash chips, aka SSDs?. Flash chips are designed to store one or more bits in a single transistor. single-level cell (SLC) flash, only a single bit is stored within a transistor (i.e., 1 or 0).