PPT-Phase2 Pixel Sensor:

Meeting on D Bortoletto Purdue University amp University of Oxford D Bortoletto May 20 2014 CMS Tracker Meeting 1 Bump bonding for hybrid pixels remain a dominant cost for hybrid detector The cost for. at. . Christmas. . 2014. LHC . Analysis and Physics. R+D and Upgrade. Max Klein - for the dauntless ATLAS Group - Liverpool 12.12.2014. new. Leading Roles. Liverpool ATLAS in 2014. A . Affolder. Mathieu Benoit. Outline. Analysis of 150um-on-100um n-in-p assemblies. Status of submission to . Advacam. Methodology. After wire-bonding, chip is powered, sensor biased at 40V. Chip threshold equalization is performed twice, mask pattern is written to disk. IBL – . Insertable. B-Layer. Tobias Flick. University Wuppertal. 17.09.2009, VERTEX 2009 . Putten. , Netherlands. Preliminary. Overview. Current ATLAS pixel detector. What is the IBL and why do we need it?. Interagency Accessibility Forum. Jordan Hirsch. Director of Digital Strategy, Phase2. @. jordanhirsch. Successful . Requirements Gathering. Questions?. Who Am I? Why Am I Here?. Jordan Hirsch. Director of Digital Strategy,. Status @ Fermilab. Farah Fahim, Gregory Deptuch, Jim Hoff, Alpana Shenai, Marcel Trimpl. Update. Radiation tolerance tests of 130nm & 65nm are ongoing with U. Colorado using . Sandia National Lab "Gamma Irradiation Facility" (Colbolt-60 source array. Jorgen Christiansen, CERN PH-ESE. 1. Time: Thursday 15:00, Biweekly. S. pecific meeting theme or General status chat as needed. 2. Regular pixel electronics meeting. Pixel electronics system.  (overlap with detector layout, optimization, mechanics). Ivan Peric. , Roberto Blanco, Felix Ehrler, Christian Krämer, . Richard Leys, Rudolf . Schimassek. , Hui Zhang, . …. on . behalf of University of Bern, Brookhaven National . Laboratory, University . P. Riedler, CERN. Interconnect Technologies >> Talk by Michael Campbell. P. Riedler, ITS upgrade meeting Oct. 4, 2010. 1. Hybrid Pixel Detectors. Simplified view: Sandwich. Sensor. Frontend-readout chip. Richard Bates & . Dima. . Maneuski. Contents. Motivation for hybrid CMOS. Assembly. 10/03/16. R. Bates. 2. CMOS designs. Depleted Monolithic Active Pixel Sensor. HR-material (charge collection by drift). H. . Pernegger. . ~2 cm. ~2 . c. m. FE-I4 R/O Chip. 27 k Pixels. 87 M transistors. The LHC upgrade program. From now to HL-LHC:. 4/27/12. 2. IBL + . nSQP. if confirmed. New pixel and strip. The ATLAS Tracker upgrade. A novel pixel and image sensor for automotive applications is present. By combining process advancements from consumer application with automotive technology and design, the optimal high dynamic range Serena Mattiazzo. INFN & University of Padova (Italy). M. . Battaglia. ,. UC Santa Cruz (USA). P. . Denes. , D. . Contarato. Lawrence Berkeley National Laboratory, LBNL (USA). D. . Bisello. , P. . Fraunhofer. IMS. Dr. Sascha Weyers. Fraunhofer IMS. Infrastructure – CMOS . Fab. Total . a. rea: 1300 m. 2. Clean room . c. lass: 10. Wafer size: 200 mm (8 inch; 0.35 µm). Staff: working in 4 shifts / 7 days a week . high resolution imaging of. the Jovian system. Matthew . Soman. , Andrew . D. . Holland, . Konstantin D. . Stefanov. , . Jason P. . Gow. , . Mark . Leese. Centre . for Electronic Imaging, The Open University, MK7 6AA, .