Meeting on D Bortoletto Purdue University amp University of Oxford D Bortoletto May 20 2014 CMS Tracker Meeting 1 Bump bonding for hybrid pixels remain a dominant cost for hybrid detector The cost for ID: 264479
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Slide1
Phase2 Pixel Sensor: Meeting on
D. Bortoletto, Purdue University & University of Oxford
D. Bortoletto, May 20, 2014
CMS Tracker Meeting
1Slide2
Bump bonding for hybrid pixels remain a dominant cost for hybrid detector. The cost for
a single detector unit have been over € 200 - 300
Readout chip (ROC) : sensor chip (SC) : bump bonding (cost ratio) = 1:2:7!
BB technology used in CERN pixel detectors is not commonly available in small volumes.
Flip chip assembly part has caused the rise in total costs during last two years (pie diagrams).
D. Bortoletto, May 20, 2014
CMS Tracker Meeting
2
Phase 2 Pixel Sensor Working
group meeting
M.
CampbelSlide3
In this meeting we would like to discuss with companies the challenges for Phase 2
The environment of HL-LHC:
Operations in 140 collisions per bunch crossing at 5
x1034
cm
-2 s
-1 and 40 MHz
Maintain occupancy at ≈ % level
Higher granularity / smaller pixel require smaller thinner pixels
D. Bortoletto, May 20, 2014CMS Tracker Meeting
3
Phase 2 Pixel Sensor Working group meetingSlide4
tryD. Bortoletto, May 20, 2014
CMS Tracker Meeting
4
Pixel geometries
PIXEL SIZES
under ConsiderationSlide5
What is the minimal bump bonding pitch and bump bonding pad size that can be achieved with your technology?How large can the die be or bb density to achieve a good yield (similar to the one that was achieved by the current pixel sensors) ?
What is the minimum thickness of the ROC and sensor wafers that you can handle?Are they any interesting development in BB that we should be aware of?
Any other issue that we should consider?
D. Bortoletto, May 20, 2014
CMS Tracker Meeting
5
The questions