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2020Si Photonics market perspectives from pluggable transceivers to copackaged switches ASICDr Eric MOUNIERYoleDveloppement2YoleDveloppementwhoareweWhySiPhotonicsMarketforecastPlayersGoingfurthertha ID: 877683

packaged photonics transceivers silicon photonics packaged silicon transceivers hybrid optical optics switch intel switches 100g channels pluggable siph 2020

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1 From Technologies to Markets © 2020 Si P
From Technologies to Markets © 2020 Si Photonics market perspectives: from pluggable transceivers to co - packaged switches ASIC Dr. Eric MOUNIER Yole Développement 2 Yole Développement, who are we ? Why Si Photonics ? Market forecast Players Going further than pluggable transceivers : co - packaging Outlook CONTENT © 2020 From Technologies to Markets Yole Développement Who are we ? 4 ©2019

2 | www.yole.fr | About Yole Développemen
| www.yole.fr | About Yole Développement FIELDS OF EXPERTISE COVERING THE SEMICONDUCTOR INDUSTRY Semiconductor, Memory & Computing o Semiconductor Packaging and Substrates o Semiconductor Manufacturing o Memory o Computing and Software Power & Wireless o RF Devices & Technologies o Compound Semiconductors & Emerging Materials o Power Electronics o Batteries & Energy Management Photonics & Sen

3 sing o Photonics o Lighting o Imaging
sing o Photonics o Lighting o Imaging o Sensing & Actuating o Display 5 PART OF YOLE GROUP OF COMPANIES M&A and evaluation of companies Direct acces to the analysts Market, technology, and strategy consulting Teardown and reverse engineering Cost simulation tools Structure, process and cost analysis 6 A WORLDWIDE PRESENCE 100+ collaborators in 8 different countries Headquarters › Lyon â€

4 “ Yole Développement › Nantes – Sys
“ Yole Développement › Nantes – System Plus Consulting Singapore Tokyo Shenzhen Hsinchu Lyon Frankfurt Nantes Boise Cornelius Raleigh Phoenix Austin Seoul 7 https : //www . i - micronews . com/products/silicon - photonics - 2020 / OUR NEW SI PHOTONICS REPORT Intel Silicon Photonic 100G PSM4 QFSP28 Transceiver Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver Why Silicon Photonics? 9

5 SILICON PHOTONICS - MOTIVATIONS Lower p
SILICON PHOTONICS - MOTIVATIONS Lower power consumption High data rates Lower $ / Gbps Leverage the semiconductor industry Better reliability Smaller photonics components Optics and ICs are getting closer 10 COMPARING SILICON PHOTONICS WITH OTHER PIC PLATFORMS InP - based PICs have been demonstrated for all building blocks. Nowadays, optical components are built using many kinds of materia

6 ls, each with their respective merits an
ls, each with their respective merits and drawbacks. These inc lude element semiconductors (Si and Ge - related), compound semiconductors (InP and GaAs - based), dielectrics (SiO2 and SiNx - related), polymers, and nonlinear crystal materials (i.e. LiNbO3). The material properties of different material systems place them into desirable, but discrete functionality regimes. Building Block InP S

7 iPh SiN Glass Polymer Silica LiNbO3 Pass
iPh SiN Glass Polymer Silica LiNbO3 Passive components ++ ++ +++ +++ +++ +++ Hybrid Polarization components ++ ++ ++ + + Hybrid Hybrid Lasers +++ Hybrid Hybrid Hybrid Hybrid Hybrid Hybrid Modulators +++ ++ + Thermal +++ Hybrid ++++ Switches ++ ++ + + + + Hybrid Optical amplifiers +++ Hybrid Hybrid Hybrid Hybrid Hybrid Hybrid Detectors +++ ++ Hybrid Hybrid Hybrid Hybrid Hybrid PROs • Best for l

8 aser integration • Best for electro
aser integration • Best for electronic/optical integration • Low cost • Small size • Simple process, low cost • Compatible with Si/InP platforms • Low losses • Low cost • Very good modulation function CONs • High cost and low yield for components integrating other elements. • No light generation • Material properties are process - dependent • Few functions

9 are possible • Reliability / thermal
are possible • Reliability / thermal management issues • No active functionalities • Not a thin - film tech yet INDUSTRY STATUS HIGH - VOLUME LASER RAMPING UP TO high - volume transceiver LOW - VOLUME PRODUCTION PRE - SERIES R&D/ QUALIFICATION HIGH - VOLUME couplers and ?? HIGH - VOLUME modulators • There are two major industrial platforms: InP and SiPh. • SiN is commercialized

10 by LioniX with TripleX platform. •
by LioniX with TripleX platform. • Polymer is only developed by LightWave Logic. • Glass is a simple technology, but only a few optical functions are possible. • LiNbO3 is best for modulation. • Silica is low - loss and low - cost. 11 SILICON PHOTONICS - APPLICATIONS Low volumes DATA CENTER INTERCONNECTS (In row/inter/intra/metro/long haul/sub - sea) � 100M units $0.10 to $5 1

11 M units $100 to $5000 AUTOMOTIVE LIDAR &
M units $100 to $5000 AUTOMOTIVE LIDAR �10M units $1 to $50 AERONAUTICS High volumes �1M units $10 to $500 DEFENSE MEDICAL SENSORS HPC, computing, AI 5G TELECOM AI: Artificial intelligence HPC: High - performance computing 12 SiPh IN OPTICAL COMMUNICATION - APPLICATIONS Inter datacenter 100/200/400G DWDM 100G SMF 100G SMF 100G SMF 25G Cu or AOC AOC: Active Optical Cable DWDM: Den

12 se Wavelength Division Multiplexing SMF:
se Wavelength Division Multiplexing SMF: Single - Mode Fiber Silicon photonics can be applied here. 10km - metro 500m – 2km 300m – 2km 100m – 500m 1m – 30m Datacenter Market Forecast 14 SILICON PHOTONICS FORECAST, BY APPLICATION 2019 - 2025 forecast Optical communicatio n is and will remain silicon photonics’ most important application. 2025e 2019 Datacenter transceiver

13 s Long haul transceivers Optical interco
s Long haul transceivers Optical interconnects Immunoassay $364M $3.6B CAGR 46% $186M CAGR 8% Total $480M Total $3.9B CAGR 42% $117M $22M CAGR - $18M CAGR - 5G transceivers $61M CAGR - Fiber - optic gyroscope $20M CAGR - Automotive LiDAR $44M CAGR - 15 SILICON PHOTONICS SHIPMENTS, PER APPLICATION Silicon photonics shipments will reach 26 Munits in 2025 , with a CAGR of 36 % . Si photonics pl

14 ayers 17 SIPH SUPPLY CHAIN FOR OPTICAL
ayers 17 SIPH SUPPLY CHAIN FOR OPTICAL TRANSCEIVERS Design SOI substrate Epi wafer Foundry Transceiver Systems (out of business) Coherent optical communication Systems include servers, routers, and switches And more… 18 DATACENTER S i P h TRANSCEIVERS - 2019 MARKET SHARE 3.4 Munits • In datacenter silicon photonics transceivers for 2019, Intel and Cisco/Luxtera were the main players, with

15 Inphi and Sicoya a lso shipping product
Inphi and Sicoya a lso shipping products. Things could change in the coming years, since several companies will introduce silicon photonics transcei ver s with 400G DR4 and 400ZR standards. Going further than pluggable transceivers : co - packaging 20 CO - PACKAGED OPTICS FOR NETWORK SWITCHES In order to increase the data rate density in switches, co - packaged optics is a solution. co

16 urtesy of Intel courtesy of Intel In co
urtesy of Intel courtesy of Intel In co - packaged optics, the switch ASIC and the optical transceivers are packaged in the same device . This allows for reducing the physical distance between the ASIC and the transceivers , thus reducing heat dissipation. It is a key technology for reaching higher data - rate densities, and silicon photonics is a key enabler for co - packaged switc

17 hes. Prototype of a 25.6 Tbps switch f
hes. Prototype of a 25.6 Tbps switch from Intel. The green part is an interposer. Each photonics engine consists of 16 100G channels operating at PAM4, thanks to micro - ring modulators (MRM). courtesy of Sumitomo Electric Industries Side - view of co - packaged optics. 21 DATACENTER SWITCHES AND TRANSCEIVERS - TRENDS The continuous increase of data rate could result in a change from

18 pluggable to co - packaged transceiver
pluggable to co - packaged transceivers for network switches. Switch data rate Transceiver data rate 2017 2020 2022 2025 5Tbps 100G *200G 400G 800G 4 channels at 25G PSM or CWDM 25G channels are NRZ 50G channels are PAM4 4 channels at 50G PSM or WDM 8 channels at 25G Ex.: 48 ports at 100G x2 x2 x2 x2 x2 x2 8 channels at 50G PSM or WDM 16 channels at 25G Ex.: 32 channels at 50G Pluggable tra

19 nsceivers Co - packaged transceivers Ex.
nsceivers Co - packaged transceivers Ex.: 16 channels at 100G Co - packaged switch ASIC Pluggable Co - packaged *Some companies could skip the 200G step. 25.6Tbps 51.2Tbps 12.8Tbps 22 CO - PACKAGED OPTICS - PLAYERS INVOLVED Intel acquired Barefoot Networks in June 2019 Tofino 2 Switch ASIC Co - packaged SiPh transceivers Using TSMC 7nm foundry Co - packaged SiPh transceivers Network sw

20 itch Network switch Cisco acquired Luxte
itch Network switch Cisco acquired Luxtera in February 2019 Cisco acquired Leaba in March 2016 Switch/Router ASIC Co - packaged SiPh transceivers Optical interconnection Co - packaged Optics Collaboration (June 2019) Specifications Optical interposers Co - packaged SiPh transceivers Fiber V - groove interconnects Co - packaged fine - pitch socket interposer Fiber - optic connectivity Co

21 - packaged fine - pitch socket interpo
- packaged fine - pitch socket interposer Co - packaged SiPh transceivers Si - fly copper TGA Integration courtesy of Intel 23 CO - PACKAGED OPTICS - EXAMPLES (1/2) Several companies have demonstrated co - packaged optics for network switches. In March 2020 Intel demonstrated a network switch using co - packaged optics. The silicon photonics engines are capable of 1.6Tbps. The s

22 witch is expected to achieve 25/6Tbps
witch is expected to achieve 25/6Tbps with 16 engines and the Tofino2 switch ASIC. Co - packaging is achieved using interposers. In March 2020 Rockley Photonics, in collaboration with Accton , Molex, and TE Connectivity, demonstrated a co - packaged optic switch with 6Tbps with a target of 51.2 Tbps . courtesy of Intel courtesy of Rockley 24 CO - PACKAGED OPTICS - EXAMPLES (2/2) Seve

23 ral companies have demonstrated co -
ral companies have demonstrated co - packaged optics for network switches. In March 2020, Ranovus announced a collaboration with IBM, TE Connectivity, and Senko for co - packaged optics targeting 51.2 Tbps network switches. courtesy of Ranovus courtesy of IBM IBM Canada has developed several packaging technologies for optical fibers. IBM will provide optical interconnect techno

24 logies that enable automated and scalab
logies that enable automated and scalable assembly for co - packaged optics. 25 DARPA’S PIPES PROJECT Photonics in the Package for Extreme Scalability (PIPES) Aiming for above 100Tbps chip - to - chip interconnect speeds. Optically connected FPGA board developed by Intel and Ayar Labs. source: Ayar Labs The DARPA PIPES project, involving leading silicon photonics companies, aims at

25 increasing chip - to - chip interconnec
increasing chip - to - chip interconnection speed by using silicon photonics. Recently, Intel and Ayar Labs demonstrated 2Tbps communication on an FPGA . The project’s aim is to achieve communications above 100Tbps. Outlook 27 SILICON PHOTONICS - ROADMAP FMCW: Frequency Modulated Continuous Waves FOG: Fiber Optic Gyroscope OCT: Optical Computed Tomography OPA: Optical Phased Array R

26 FOG: Resonant FOG 2020 2025 2016 100G pl
FOG: Resonant FOG 2020 2025 2016 100G pluggable transceivers using coherent and direct detection 400G DR4 transceivers for datacenters 400ZR coherent transceivers Co - packaged optic switch at 25.6 or 51.2Tbps Photonic FOG Data & telecom Automotive Medical RFOG FMCW LiDAR for ADAS or robo - taxi OPA LiDAR Immunoassay for point - of - need OCT for ophthalmology or other applications Wit

27 h volume production in pluggable transc
h volume production in pluggable transceivers, silicon photonics is expanding into new applications: automotive, medical, and consumer. Consumer E - noses in smart white - goods 28 CONCLUSIONS Silicon photonics Pluggable transceivers are silicon photonics’ main market. Other applications are on the way. • Pluggable transceivers using silicon photonics are now sold in millions.

28 This means silicon photonics technology
This means silicon photonics technology is now well established in an important number of foundries. • Co - packaged optics for network switch, in which optical functions and electronic functions are packaged in the same device, is expected to be the major silicon photonics application in the future. It appears to be a key technology for enabling 25.6Tbps and 51.2Tbps switches. • The ver

29 tical integration of silicon photonics t
tical integration of silicon photonics transceiver companies and silicon photonics platforms is still on the way. Moreover, several companies are now entering the silicon photonics transceiver market. • The diffusion of silicon photonics technologies in various foundries allows for developing new applications. © 2020 From Technologies to Markets Eric Mounier YOLE DEVELOPPEMENT eric.mounie