PPT-1 3.1 Introduction to Bonding

Bonding is the joining of two atoms in a stable arrangement There are two different kinds of bonding Elements will gain lose or share electrons to reach the electron configuration of the noble gas closest to them in the periodic table. 92B is applicable to bonding at services and in part states Bonding jumpers meeting the other requirements of this article Article 250 shall be used around concentric or eccentric knockouts that are punched or otherwise formed so as to impair the ele (. Benzene. ). 140 pm. 140 pm. 140 pm. 140 pm. 140 pm. 140 pm. All C—C bond distances = 140 pm. Benzene. empirical formula. = CH. 140 pm. 140 pm. 140 pm. 140 pm. 140 pm. 140 pm. . 146 pm. 134 pm. Introduction to Chemical Bonding. Introduction to Chemical Bonding. Objectives:. Define . chemical bond.. Explain why most atoms form chemical bonds.. Describe ionic and covalent bonding.. Explain why most chemical bonding is neither purely covalent nor purely ionic.. Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. CA Standards. Students know . the atoms and molecules in liquids move in a random pattern relative to one another because the intermolecular forces are too weak to hold the atoms or molecules in a solid form.. Metals. Look at the Periodic Table…. 75% of elements are metals!. Metals. They can vary a lot…. General Properties of Metals. Dense. Malleable. Ductile. Good conductors of heat and electricity. Shiny Lustre. What types of things bond together?. Think-pair-share with your neighbor all of the things that bond together.. Share with entire class. What would happen if the bonds didn’t hold or were weak?. Bonding. Chemical bonding. Chemical Bonding. Diamond. Silicon dioxide. Graphite. Ionic Bond / metallic bond / covalent bond. Nature of the bond. Physical properties . Melting point / boiling point. Electrical conductivity. IB Topics 4 & 14. Text:. Ch 8 (all except sections 4,5 & 8). Ch 9.1 & 9.5. Ch 10.1-10.7. My Name is Bond. Chemical Bond. PART 5: Giant Covalent Structures, Metallic Bonding & Physical Properties. Electrons are transferred from an atom of low electronegativity to one of high electronegativity. Anion (-) and cation ( ) formed. Opposite charges attract – called an . electrostatic force. Formula Unit. 4.4.1: Describe the metallic bond as the electrostatic attraction between a lattice of positive ions and delocalized ions. . 4.4.2. : Explain the electrical conductivity and malleability of metals. . A Unique Job Placement Tool. A business insurance policy that protects the employer in case of any loss of money or property due to employee dishonesty. What is the Federal Bonding Program?. What makes this program great?. Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. Day . 6. – Venn Diagram, . haber. Process. Metallic . Bonding, Properties of Substances reading, . Warm up. ON PAGE 23. What do ionic and covalent bonding have in common? What is different?. Time: .