October 21 2014 Project Manager Gabrielle Massone Deputy Project Manager Financial Lead Tanya Hardon Optics Lead Jon Stewart Mechanical Lead Jake Broadway Electrical Lead Logan Smith ID: 721057
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Slide1
Preliminary Design ReviewOctober 21, 2014
Project Manager:Gabrielle MassoneDeputy Project Manager Financial LeadTanya HardonOptics Lead:Jon StewartMechanical LeadJake BroadwayElectrical Lead:Logan SmithSystems Engineer:Jesse EllisonSoftware Lead:Cy ParkerTest and Safety Lead:Franklin HinckleyThermal Lead:Brenden HoganCustomers:Brian Sanders Colorado Space Grant (COSGC)JB Young and Keith MorrisLockheed Martin (LMCO)Faculty Advisor:Dr. Xinlin LiDept. Aerospace EngineeringLaboratory for Atmospheric and Space Physics (LASP)
1
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide2
Presentation OverviewMission OverviewBaseline DesignFeasibility Analysis
Optics and Mechanical DesignThermal DesignElectrical and Software DesignTesting Plan and FeasibilityDesign SummaryLogistics2OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide3
Project Overview
3OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide4
Mission BackgroundLockheed Martin 6U CubeSat Bus Design Reference Mission
to Asteroid 101995-Bennu4OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide5
Mission BackgroundLockheed Martin 6U CubeSat Bus Design Reference Mission
to Asteroid 101995-Bennu5OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsRelevant IR Camera Payload Operations that Drive Phoenix ConOpsSlide6
Mission BackgroundLMCO Bus IR Camera Payload will capture sequence of images of
Bennu asteroid and measure the observed angular rate3.5 µm wavelength in Mid-Wave Infrared (MWIR) Range and geometry specified below:6OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsBennu Asteroid (Reference Environment)IR CameraBennu
FOV
Distance: 10 km
ω
= 0.4061
mrad
/s
Observed:
θ
= 21.93 µrad/s
D = 492 m
T
amb
= 3K
T
sur
= 180-310K
ε
= 0.035Slide7
Mission BackgroundUtilize MWIR nBn detector (Lockheed Martin Santa Barbara
Focalplane)Operating Temperature: 140 KResolution: 1.3 MPx or 1280x1024First MWIR detector Feasible for CubeSat Operations 7OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsReduced Dark Current, Operating Temp. of 140+ K vs 77 K (Traditional)InAs N-doped Semiconductor Layers Sandwiching 100 nm AlAsSb BarrierFigures courtesy of: Applied Physics Letters, October 9, 2006 - 151109Slide8
Mission Background1.3 MPx
(1280x1024) nBn detector Image8OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsFigure courtesy of: laserfocusworld.com January 17, 2014Slide9
Phoenix Objectives
Proto-flight Unit: Defined as hardware that is designed to flight form-factor, but may require additional design, development, testing or flight certification. Not required to undergo environmental testing (thermal-vacuum cycling, vibe, radiation testing, etc…) and will not be flown.9To develop and test the 2U CubeSat MWIR Camera Proto-Flight Payload, a precursor to the flight camera unit for the LMCO Bus MissionOverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide10
Phoenix Objectives10
OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsReq.DescriptionParentO.1The payload shall integrate electrically and structurally into the 2U payload section of the Lockheed Martin 6U CubeSat busMS1.SYS.1The electrical system shall interface with the LMCO 6U CubeSat busO.11.SYS.2The mechanical system shall interface with the LMCO 6U CubeSat busO.11.SYS.3The Software system shall interface with the LMCO 6U CubeSat bus
O.1
O.2The payload shall capture a sequence of IR images at the 3.5 µm wavelength and determine the angular velocity and axis of rotation of an observed object with characteristics of the reference asteroid 101995-Bennu
MS
2.SYS.1The electrical system shall capture and store an image from the image sensor.
O.22.SYS.2The optical system shall be able to observe and image the reference target
O.2O.3The payload
shall maintain all components in their operating temperature ranges.MSSlide11
CubeSat Bus Design Constraints11
Bus Electrical ConstraintsRegulated Voltage Lines3.3 V6.0 A Max12 V4.0 A MaxUnregulated Voltage6.5 V – 8.6 V6.0 A MaxTotal Power5 W Nominal Average15 W PeakCommand Communication BusSPI SlaveHigh-Speed Communication BusEthernet, Magnetics-Less DifferentialBackup Communication BusI2CBus Structural ConstraintsTotal Volume 2U (10x10x20 cm)Total Mass2.66 kg + 0.1 kg/ - 0.5 kgOverviewBaseline DesignOptics
Thermal
Electrical
Testing
LogisticsSlide12
Timeline and AssumptionsPhase 1: Simplifying Assumptions
Simulated range between Phoenix and target will vary between 10 km and 100 kmZero Relative translational velocity between object and bus during observation (Phase 2 unit software will account for relative motion)Phoenix payload is not exposed to direct sunlight (i.e. bus orientation or deployables shade payload volume)All test target properties are representative of asteroid 101955-Bennu to the extent feasible12OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsPhase 1May 2015Oct 21
Prototype of all subsystems
First integration and ground-testing
Flight RevisionContinue Remaining Development
Senior Design
Potential Post-Senior Design Development
Delivery
Fully-tested, flight certified
Phase 2
MilestonesSlide13
Phoenix ConOps13
OverviewBaseline DesignOpticsThermalElectricalTestingLogistics Instantaneous observed angular rate of the nearest point is the arctangent of the translational velocity of the surface divided by the observation distance
d
Phoenix is measuring the observed angular rate (theta), not the rotation rate of the object (omega)Slide14
Phoenix ConOpsCulmination of design is fully-integrated ground-test of sensor and representative target object
14OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide15
Baseline Design
15OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide16
Design Overview
16RadiatorPanelsBus Mechanical InterfacePower BoardCDH BoardThermal StrapSensor Board
Primary Mirror
Secondary Mirror
2U CubeSat Payload
10cmx10cmx20cm
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
Logistics
10 Cm
10 Cm
2
0 CmSlide17
Functional Block Diagram17
OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsStructure and Optics Focusing AssemblyStructureThermal Control Mechanism
Optics Assembly
* LMCO 6U CubeSat Bus
Electronics
Bus Thermal Isolation
*Sensor Interface
(COSGC)
Field of View
Phoenix Camera Payload
*COTS or Customer-Provided
*Image Sensor (LMCO)
Camera Controller
Main Processor
Image Processing and Compression Software
Thermal Controller
Power Regulation
Bus Power and Data Interface
PWR
PWR
PWR
Thermal Feedback
Image Data, Sensor Control
PWR
PWR
Post-Processed Image Data
Power
Bus Power Supply
DataSlide18
Critical Project ElementsMechanical Optics Assembly DesignThermal System DesignCooling the nBn sensor
Electronics and Software SystemInterfacing with nBn sensorMeasuring Rate from Image SequenceTesting PlanGround testing to simulate flight functionality18OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide19
Optics and Structure
19OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide20
Bennu Radiometry
Percentage of total light in 3 to 4 µm band due toSolar irradiance (~12-15%)Bennu blackbody radiation (~85-88%)Photon Budget: 20OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsTotal Photon FluxPhoton Flux (photon/s)Range (km)Cassegrain
Optics
Refractive Optics
40
6
0
8
0100
3x10132
x10131x1013Slide21
Bennu Radiometry21
OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide22
Baseline Optical DesignCDD baseline designs:Multi-element refractive & Cassegrain optical systems
MWIR bandwidth is diffraction limited22OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSource: http://microscopy.berkeley.edu/courses/tlm/optics/imaging.htmlDiffraction Limit IllustrationResolvable Airy Disk
Resolvable Airy Disk
Unresolvable Airy Disk
Unresolvable Airy Disk
Airy DiskSlide23
Baseline Optical DesignChief deciding factors: Mass, Thermal Control, Size, etc…
23OverviewBaseline DesignOpticsThermalElectricalTestingLogistics
Cassegrain selected for O
ptical Design
Refractive
Mass ~ 1.8 kg
Active Thermal Cooling
Chromatic Aberrations
Length ~ 12.5 cm
High Design Complexity
Bandwidth: 3.0 – 3.74 µm
Cassegrain
Mass ~
1.0
kg
Passive Thermal Cooling
No Chromatic Aberrations
Length ~ 10 cm
Bandwidth: 3.0 to 3.61 µmSlide24
Zemax SimulationUtilized paraxial ray tracing equations to derive design constraints
Zemax simulation to prove design methodology 24OverviewBaseline DesignOpticsThermalElectricalTestingLogistics
Spot Diagram
FPA
Primary Mirror
Secondary Mirror
Cassegrain SimulationSlide25
Mechanical Budget
SubsystemMass (g)Structures328Optics81Electronics59Thermal Control157Total625Allowable Mass2000Contingency137525OverviewBaseline DesignOpticsThermalElectricalTestingLogistics
Large Mass Contingency
Values from
Solidworks Model EstimatesSlide26
Path ForwardDesign aspherical lenses to reduce aberrations and add bandpass filter
Make Zemax program to optimize system PSF and minimize ΔT impacts on systemDesign cold stop to reduce background thermal noiseThorough calculation of SNR and SBR with respect to all noise inducing elementsCall prospective suppliers to check for issues with budget and feasibility constraints26OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide27
Thermal
27Slide28
Current Thermal ConceptBus will shield the payload from solar rays
Bus interface within -24 to 61 ºCInterface will be isolated using low conductance bolts and/or structural elementsMLI insulation between bus and payloadAluminum radiators coated in high-emissivity white paint on all payload sidesTEC to reduce focal plane temperature to ~140KFrom manufactures specification28OverviewBaseline DesignOpticsThermalElectricalTestingLogistics
6U Bus Conceptual Configuration
2U Phoenix Camera VolumeSlide29
Thermal Electric Cooler (TEC)Operates using the Peltier
EffectP and N type semiconductors physically in parallel but electrically in seriesDraws heat from one side to the otherCan be stacked to produce additional coolingTwo Stage Baseline Model~1W of consumed powerMax heat in: 0.3WDelta Tmax: 92 KSmall Size3.9mm x 3.9mm x 4.4mmLong operating life<100,000 hrs29Source: https://www.ferrotec.com/images/thermal-site/twoStage.pngOverviewBaseline DesignOpticsThermalElectricalTesting
LogisticsSlide30
Primary Thermal Paths30
Bus Interface T = -21 to 64 ºCQbusOverviewBaseline DesignOpticsThermalElectricalTestingLogisticsQSunAluminum Radiator 700cm
2 (White Paint Coating α=0.09
ε=0.92)
Q
Radiated
Q
albedo
Optics Assembly
TEC
W
bus
nBn Focal Plane
Command and Data Handling (CDH) Board
Electrical Power and Bus Interface Board
Thermal Isolation
Q
Radiated
Bus Solar Shade
Bus Solar Shade
Phoenix Payload
Key
Radiation
Conduction
High Resistance
Low Resistance
Electric WorkSlide31
Thermal Modeling Strategy
Goal: Full System Thermal Model using Thermal Desktop SoftwareFall 2014: Develop basic thermal models comparing ~10-25 nodes in both Simulink and Thermal DesktopPost-CDR: Continue Thermal Modeling with Thermal DesktopGoal: model agrees to within ± 5 K of actual hardware temperatures (AFRL Standard)Driving Issue:Thermal Desktop results are complex - it can be difficult to identify errors in basic modelSolution:Develop two independent modelsVerify results of Thermal Desktop model before moving forward31OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide32
Thermal Desktop Model (Steady State)32
Aluminum Radiators with White Paint Coating Bus-Payload Mechanical Interface~10WCDH Board~0.3WEPS Board (Not-Pictured, behind CDH board)~0.7WNot currently in modelThermal Electric Cooler~1WnBn Focal Plane~0.3WOptics Assembly
Bus Simulator
Modeled as 10W constant heat source
Hottest part of the payload is the bus interface
CDH Board
EPS Board
EPS Board
Cold Space ~3K
Green Arrows-Conduction to parts contacting that face
Brown Arrows-Conduction receiving nodes from other parts contacting that face
Red Arrows-Heat loads on that surface
Balls-Nodes of the model
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide33
Simulink Thermal Model33
OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsMajor components modeled as Simulink subsystems with heat inputs and outputsSubsystem blocks contain models of thermal resistivities and conductivitiesSlide34
Feasibility Analysis (Simulink)34
RadiatorArea700 cm2Emissivity0.92MaterialAluminumThermal ConductivitiesAluminum237 W/(m*K)PCB (FR4/Copper)0.33 W/(m*K)Glass (Optical Lenses)1.05 W/(m*K)Bus InputsMax Qin10 WQin to Electronics7 W (30%)Qin to Optical Assembly3 W (70%)Qin to TEC/Focalplane0 W (negligible)Asteroid InputsMax Qin
1.56 μW
Qin to Focalplane0.312 μW (20%)
Qin to Optical
Assembly1.248 μW (80%)Qin to TEC/
Focalplane0 W (negligible)
Other PropertiesGlass Emissivity
0.93Time to Steady State
10,000 seconds
Simulink Simulation Assumptions & Parameters:
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide35
Feasibility AnalysisUsing the worst case power inputs, the steady state temperature is low enough for the TEC to cool the focal plane to 143K (
ΔT ~92K). While this is higher than the optimal 140K, the noise induced by the higher temperature could be processed out. Additionally the optical assembly does not need to be cooled35Simulation InputsHeat from Bus into Sys.10 WHeat from Asteroid1.5 μWPower into Focalplane0.3 WPower into Electronics1.0 WPower into TEC1.0 WTotal Energy into Sys.12.3 WSimulation OutputsHeat out of Radiator11.2 WHeat out of Optics3.0 WHeat out of TEC2.4 WHeat out of Electronics7.3 WHeat out of Focalplane0.8 WSteady State Tradiator235.4 KOverview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide36
Feasibility AnalysisThe steady state temperature drops by 5K, reducing the necessary
ΔT to 90K. This shows that with a 10% reduction in heat from the bus the TEC can cool the focal plane to the desired temperature. 36Simulation InputsHeat from Bus into Sys.9.0 WHeat from Asteroid1.5 μWPower into Focalplane0.3 WPower into Electronics1.0 WPower into TEC0.3 WTotal Energy into Sys.10.6 WSimulation OutputsHeat out of Radiator10.2 WHeat out of Optics2.70 WHeat out of TEC2.24 WHeat out of Electronics6.6 WHeat out of Focalplane0.69 WSteady State Tradiator230.0 KOverview
Baseline Design
Optics
Thermal
Electrical
Testing
Logistics
Considering a case where the payload receives less heat from the bus (the bus is in a power saving mode, and less subsystems are turned on, therefore less heat is generated)Slide37
Path ForwardContinue adding payload elements to the Thermal Desktop ModelUpdate the Simulink Model material properties as materials are chosen
Compare the results of the two models to verify consistency and accuracyUse Thermal Desktop Model for final thermal analysisExtra volume available if additional active thermal control required Linear Stirling Cooler or multiple TECsExploring Thermal Isolation mechanismsMLI, high thermal-resistance materials37OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide38
Electrical and Software
38OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide39
Electronics Overview39
OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsnBn Image SensorImage Sensor BackplaneCommand and Data HandlingPower Regulation
Raw Image Data
Power
Small Adapter Board for nBn Mid-Wave IR Sensor
Low Thermal Resistance Substrate
Processes Images and Commands
High-Density Multi-Layer Board
Provides power regulation and isolation from the bus
Primary bus interface
Baseline Design: Custom PCB StackupSlide40
Electronics40
Image Sensor BackplaneCommand and Data HandlingPower Regulation & IsolationBus InterfacePower RegulationIsolationThermal Electric Cooler SwitchingMonitoring & Protection CircuitryImage Sensor InterfaceMemoryCPUnBn Sensor
TEC
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide41
Power Budget
Design ElementReference ComponentNominal Power ConsumptionTECLaird MS2 series1.0 WCPUAtmel SAMA5D4 series0.20 WImage Sensor InterfaceXilinx Spartan3 series0.16 WFocal PlanenBn-sensor0.05 WMemoryMicron SDRAM0.39 WPower RegulationBuck/Boost 90% efficient0.80 WTEC ControlBuck 90% efficient0.10 WRaw TotalNo Margin2.7 WSystem Margin20%0.54 WTotal + Margin3.2 W
Contingency
1.8 W
41
Budget 5W nominal, 15W 10 minute burst
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide42
Software Flow Diagram42
Standby ModeActive ModeInitializeWait for CommandPackage DataSend Data to BusCommand?Picture CommandReport Health and StatusGet Focalplane Temp
nBn Cool?
Take Picture Burst
Picture
Cmd
Type
Compress Image and Package
Send Image to Bus
Determine Rate
No
Yes
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
Logistics
Rate Determination Algorithm
(Cont. Next Slide)Slide43
Software Flow DiagramHarris Corner DetectionInterest
point identifierInvariant to translations and rotationsSIFTUsed to classify each interest point and keep only those robust to local affine distortion43Rate Determination AlgorithmNoise Reduction (Optional)Harris Corner Detection & SIFT Keypoint DescriptorsRepeat for 2+ Image SequenceOverviewBaseline DesignOpticsThermalElectricalTesting
Logistics
Match SIFT
Keypoints
Calculate Rate Solution
Send Solution to BusSlide44
ExamplesHarrisSIFT Algorithm
Interest Point Detection and MatchingImage Rotated 180º44OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsFigure generated using Integrated Vision Toolkit and HarrisSIFT AlgorithmSlide45
Temporal Budget
Maximum allowable exposure time 2.28 secondsBennu rotation rate + 1σ = ~22μradians/secondRotation of 50 μradians corresponds to a single pixelCorresponds to minimum spacing of imagesMaximum image capture spacingCase of rotation gives about 9 hoursWill use as baseline limit 45OverviewBaseline DesignOpticsThermalElectricalTestingLogistics
T = 9
Hrs
Surface Feature
T = 0
HrsSlide46
Path ForwardDetermine data rates and create data budgetSelect Processor and Electrical Components
Begin Electrical SchematicsSelect Software PlatformOperating System (i.e. Linux)Bare MetalSoftware Algorithm development46Slide47
Testing Feasibility
47OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide48
Preliminary Testing PlanSetup and Procedure
Test Chamber contains Phoenix Camera and Test TargetOptics AdapterMGSE structureEGSE conduitsPhoenix captures MWIR images, determines observed angular rateCompare theoretical and actual angular rateTest EquipmentVacuum chamber capable of < 1 torr (procurable)Liquid Nitrogen cooled to 75K (procurable)Radiative heat transfer error 5% at Tsurr = 108.9 K0.632 L/min circulation rate for∆T = 5K16.6 mL/min vaporization rateEGSE and MGSE48OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide49
Environmental ControlPhoenix Camera and test hardware mounted to sledLN
2 cooling jacket maintains ~75 K wall temperature12.5” fiberglassinsulation (two layers of R19 batt) to reduce LN2 loss49OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsCross Section of Test Chamber, with minimum required dimensions12.5”Slide50
Test Target and ScalingTest Target Objective:
To replicate the scale, motion, and spectral qualities of reference asteroid 101995-BennuHollow Sphere, 10 cm diameterInternal heating elements heat to 310 K (illuminated side) and 180 K (dark side)Heater wires through slip-ring to allow target rotationOptics Adapter (Zoom 0.300X)Scaled distance: 203 cmActual distance: 61 cm50ParameterValue (Bennu)Value (Target)Diameter492 m10 cmObservation Distance10 km203 cm (effective)Rotation Rate0.4061 mrad/s0.8904 mrad/sObserved Angular Rate21.93 µrad/s21.93 µrad/sOverviewBaseline DesignOptics
Thermal
Electrical
Testing
LogisticsSlide51
Phoenix Scaled Testing
51Bennu Asteroid (Reference Environment)Phoenix (Scaled Ground Test)CameraPhoenixOptics AdapterZoom: 0.300X101995-Bennu
Actual Distance: 63 cm
Effective Distance: 203 cm
FOV
FOV
Distance: 10 km
Test Target
Hollow Sphere
Heated
ω
= 0.4061
mrad
/s
ω
= 0.8904
mrad
/s
Observed:
θ
= 21.93 µrad/s
Observed:
θ
= 21.93 µrad/s
D = 10 cm
D = 492 m
T
amb
= 3K
T
amb
= 75 K
T
sur
= 180-310K
ε
= 0.035
T
sur
= 180-310K
ε
=
~0.035
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide52
Path ForwardExplore testing opportunities and capabilities at Space Operation Simulation Center (SOSC) at Lockheed Martin in
WatertonConfer with Matt Rhode for all LN2 Handling and TestingDetail intermediate testing plans for system build-upDetermine required optical/thermal properties of test target to accuracy required for construction52OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide53
Design Summary
53OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide54
Design Summary54
nBn Image SensorImage Sensor BackplaneCommand and Data HandlingPower RegulationRaw Image DataPower2U MWIR Camera Volume, 700 cm2 Radiator AreaTwo-Stage Thermoelectric CoolerCustom Electronics and Software
Cassegrain
Reflector Optics
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide55
Logistics
55OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide56
Fall Schedule56
OctoberNovemberDecemberMajor Milestones10/13-10/1910/20-10/2610/27-11/02
11/03-11/09
11/10-11/16
11/17-11/23
11/24-11/30
12/01-12/07
12/08-12/14
12/15-12/21
12/22-12/28
12/29-01/05
PDR
Simulink
Thermal Model
Thermal Desktop Model
Zemax
Optics Model
Solidworks
Model
Electrical
Component Selection
Electrical Schematics
Electrical Layout
CDR
FFR
Overview
Baseline Design
Optics
Thermal
Electrical
Testing
LogisticsSlide57
Monetary Budget57
OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsComponentCost EstimateOptics (mirrors, lenses)$5,000Electronics$1,500Thermal$1,000Mechanical$1,000Test Equipment$1,000Total$9,500Margin 20%$1900Total + Margin
$11,400
Contingency$8600
Funds available to team: $20,000Slide58
Team Management ToolsRedmine Project Management Web Application
Issue tracking systemGantt Chart and CalendarConfiguration ManagementGit version controlCentral file storage – Odyssey serversFile and component naming schemes SYS.###.Rev_FileDescriptorEx: STR101.2_MassBudgetTest/Requirements Verification Software58OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide59
Concluding Statements
59OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide60
ConclusionsThank you for your time
AcknowledgementsPAB Faculty and StaffFaculty AdvisorDr. Xinlin LiOur customersBrian Sanders (COSGC)JB Young (LMCO)Keith Morris (LMCO)60OverviewBaseline DesignOpticsThermalElectricalTestingLogisticsSlide61
References61
[1] Adams, Arn. "ADVANCES IN DETECTORS: HOT IR Sensors Improve IR Camera Size, Weight, and Power." Laser Focus World. PennWell Corporation, 17 Jan. 2014. Web. 13 Sept. 2014.[2] "An Introduction to the NBn Photodetector." UR Research. University of Rochester, 2011. Web. 12 Sept. 2014.[3] "ARCTIC: A CubeSat Thermal Infrared Camera." TU Delft. Delft University of Technology, 2013. Web. 13 Sept. 2014.[4] Cantella, Michael J. "Space Surveillance with Infrared Sensors." The Lincoln Laboratory Journal 1.1 (1989): n. pag.Lincoln Laboratory. MIT, June 2010. Web. 9 Sept. 2014.[5] Cleve, Jeffrey V., and Doug Caldwel. "Kepler: A Search for Extraterrestrial Planets." Kepler Instrument Handbook (2009): n. pag. 15 July 2009. Web. 12 Sept. 2014.[6] "James Webb Space Telescope - Integrated Science Instrument Module."ISIM. Space Telescope Science Institute, n.d. Web. 13 Sept. 2014.[7] "NBn Technology." IR Cameras. IRC LLC, n.d. Web. 13 Sept. 2014.[8] Nolan, M.C. et al, “Shape model and surface properties of the OSIRIS-Rex target Asteroid (101955) Bennu from radar and lightcurve observations,” Icarus, Vol. 226, Issue 1, 2013, pp. 663-670.
[9]
Otake, Hisashi
,
Tatsuaki Okada, Ryu Funase
, Hiroki Hihara, Ryoiki
Kashikawa, Isamu Higashino, and Tetsuya Masuda. "Thermal-IR Imaging of a Near-Earth Asteroid."
SPIE: International Society of Optics and Photonics. SPIE, 2014. Web. 13 Sept. 2014.
[10] "Spitzer Space Telescope Handbook." Spitzer Space Telescope Handbook 2.1 (2013): n. pag. Spitzer Space Center, 8 Mar. 2013. Web. 8 Sept. 2014.
[11] Vanbebber, Craig. "Lockheed Martin Licenses New Breakthrough Infrared Technology." Lockheed Martin Corporation, 7 Dec. 2010. Web. 9 Sept. 2014.Slide62
Backup Slides
62Slide63
Trade Studies Backup
63Slide64
Trade Study Scoring10
Excellent, design best satisfies the criteria compared to the other design options8-9 Good, satisfies the criteria well5-7 Mediocre, satisfies the criteria with some difficulty or challenge3-4 Poor, difficult to satisfy design criteria, presents technical challenges1-2 Very poor, presents significant challenge to satisfy criteriaR = Raw Score W = Raw Score*Weight Total = Sum(W)64Slide65
Optics Trade Study65
Sensitivity AnalysisSlide66
Thermal Trade Study66
Sensitivity AnalysisSlide67
Electronics Trade Study67
Sensitivity AnalysisSlide68
Optics Backup
68Slide69
Paraxial Ray Tracing Equations69
Equation 2: Equation 1: http://ecee.colorado.edu/~ecen5616/WebMaterial/05%20paraxial%20ray%20tracing.pdfSlide70
Optics Design EquationsPhoton Budget:Planck’s Blackbody Radiation Equation
Stefan-Boltzmann’s LawCassegrain Constraints:70
EFL – effective focal length
BFD – back focal distance
tps
– mirror separationSlide71
Transmissive DesignCooke Triplet Constraints
Zemax Simulation71
Custom Gauss Triplet
Cooke TripletSlide72
Optical Thermal AnalysisUsed Stefan-Boltzmann equation to calculate light passing through Cold StopSignal to background ratio for 230
° K optical system72BennuSlide73
Thermal Backup
73Slide74
Peltier Effect in TEC
Thermoelectric coolers use the Peltier Effect to generate temperature gradientWhere is the Peltier coefficient of the conductor A, of the conductor B, and I is the electric current from A to B. Peltier coefficients represent how much heat is carried per unit charge. If A and B are different, and a simple thermoelectric circuit is closed then the Seebeck effect will drive a current, which in turn will always transfer heat from the hot to the cold junction. 74Slide75
Simulink – Electronics Subsystem 75
Subsystem Specific Values:Electronic Board Area – 200cm^2Electronic Board Thickness – 0.173cm Radiation Coefficient of PCB – 4.82E-8 W/m^2*K^4Specific Heat of PCB – 810 J*K/kgSlide76
Simulink – Optical Subsystem 76
Subsystem Specific Values:Optical Assembly Area – 314cm^2Radiation Coefficient of Glass – 1.1E-9 W/m^2*K^4Specific Heat of Glass – 447 J*K/kgSlide77
Simulink – Focalplane Subsystem
77Subsystem Specific Values:Focal Plane Area – 19.625cm^2Slide78
Simulink – TEC Subsystem
78Subsystem Specific Values:TEC Area – 15.21mm^2TEC Thickness – 4.4mmSlide79
Simulink – Radiator Subsystem
79Subsystem Specific Values:Radiator Area – 700cm^2Radiator Thickness – 5mmRadiation Coefficient – 5.21e-8 W/m^2K^4Radiator Mass – 0.25 kgSpecific Heat of Aluminum – 900 J*K/kgSlide80
Electronics Backup
80Slide81
Custom PCB Examples
Previous designs by Phoenix team members81Communications Board: Xilinx Kintex 7 FPGA, high-speed DDR3 MemorySlide82
Custom PCB ExamplesAttitude Determination and Control: SAMA5 ARM Processor and High-Speed Memory
82