MA Ibrahim PIPII BI Preliminary Design Review September 21 2021 DOE Scope WBS Definition and Scope System Overview Physics Requirements Functional Requirements Interfaces Technical Requirements ID: 912367
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Slide1
Beam Current Monitor (BCM) Preliminary Design Review
M.A. Ibrahim
PIP-II BI Preliminary Design Review
September 21, 2021
Slide2DOE ScopeWBS Definition and ScopeSystem OverviewPhysics RequirementsFunctional RequirementsInterfacesTechnical RequirementsPIPII-IT Accomplishments and Lessons LearnedPath to Final DesignSummaryOutlineSep 21, 20202
M.A. Ibrahim | BCM Preliminary Design Review
Slide3Design, procurement, fabrication, and testing of beam instrumentation systems for the commissioning and operation of the PIP-II complex.Includes warm front-end (WFE), superconducting Linac (SCL) and Linac-to-Booster transfer line (BTL)DOE ScopeSep 21, 20203M.A. Ibrahim | BCM Preliminary Design Review
Slide4Design, procurement, fabrication, and testing of the beam current monitor systems for the PIP-II complex.Included are the noninvasive and invasive pickups, cabling, biasing electronics, signal processing electronics, embedded firmware on the electronics, and software to interface with Control SystemNot included are the larger assemblies, to which the invasive pickups(“electrodes”) are attachedNot included are the processing of pickup signals to provide differential current measurements to Machine Protection System (MPS) system Not included are applications and services are beyond the front-end interface between the BCM System and the Controls SystemWBS 121.03.09.03.02 – BCM SystemSep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review4
Slide5CategoryTypeDescription (* - Motion Controlled / **- Water Cooled)Noninvasive (3)
DCCT
Measures and controls source current and average current out of the ion source and into the SCL
ACCT
Measure current of pulsed beam, intensity measurements for SCL tuning, operations, and MPS
RWCM
Measure the bunch-by-bunch chopping pattern and the chopping efficiency
Invasive (9)
Electrically Isolated Diaphragm (EID)
Current
loss
monitor,
scraping,
beam size measurement, beam steering, LEBT transport scheme implementationAbsorber*Beam current monitor, equipment protectionChopper CollimatorProtection of downstream components during chopping transient, tuning (steering, position)LEBT ScraperBeam collimation (e.g., small hole to create ’pencil’ beam), protection of RFQ vanes (or simply blocking the entrance of the RFQ), beam size and position measurementsMEBT Scraper*Protection of the downstream components, beam size and position measurements, intentional scraping if neededProtection ElectrodesProtect the kicker helices from direct beam impact, centering of the beam in the kicker, including in MPSDPIDifferential pumping, current loss monitors for tuningSNS Dump **Beam collector and beam current monitor, beam transmissionFinger/Halo SegmentsRough beam centering, prevent secondaries to escape (i.e. to obtain a ’true’ beam current measurement)
BCM System Overview
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M.A. Ibrahim | BCM Preliminary Design Review
Slide6Requirement #Requirement Statement F-121.3.09-A008 Noninvasive BCM system, except RWCM, shall measure the average beam current for each beam pulse in the LEBT, MEBT, SCL and transport line.
F-121.3.09-A013
BCM systems with invasive pickups shall measure the instantaneous beam current for each beam pulse in the WFE, relative to an adjustable trigger.
F-121.3.09-A014
BCM systems with RWCM pickups shall provide bunch shape information.
F-121.3.09-A009
The BCM system shall provide signals for differential beam current measurements in the MPS for each beam pulse.
Functional Requirement Specifications
(ED0008303)
Sep 21, 2020
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M.A. Ibrahim | BCM Preliminary Design Review
2mA, max
2mA, 550µs
800
Mev
Ion Source : 12mA, max
Rep Rate : 20HzExit of Chopper : 10µs to 550µs Exit of RFQ : 5mA, nominalExit of MEBT : Energy = 2.1MevBeam Current =2mA, nominal[HB650] [LB650] [ SSR2 ] [ SSR1 ] [HWR]
Slide7Measure DC current component out of ion source and into SRF cryomodulesPhysics Requirements (ED0010230) : DCCTSep 21, 20207M.A. Ibrahim | BCM Preliminary Design Review
….
LEBT
MEBT
Key Parameter
Value
Intensity accuracy
±0.1%
Approx. slot length
120 mm
*Locations Provided in PIP-II Parameters PRD (ED0010216)
Slide8Measure current and intensity of pulsed beam for SCL tuning, operations, and MPSPhysics Requirements (ED0010230) : ACCTSep 21, 20208M.A. Ibrahim | BCM Preliminary Design Review
….
LEBT
MEBT
….
MEBT
[HB650] [LB650] [ SSR2 ] [ SSR1 ] [HWR] [WFE]
Key Parameter
Value
Intensity resolution (rms)
1.5 µA
Intensity accuracy
±1%
Approx. slot length
40 mm
*Locations Provided in PIP-II Parameters PRD (ED0010216)
Slide9Measurement of bunch-by-bunch chopper efficiencyPhysics Requirements (ED0010230) : RWCMSep 21, 20209M.A. Ibrahim | BCM Preliminary Design ReviewKey Parameter
Value
Bandwidth (MHz)
0.01 to 4000 MHz
Approximate slot length (mm)
50 mm
[HB650] [LB650] [ SSR2 ] [ SSR1 ] [HWR] [WFE]
*Locations Provided in PIP-II Parameters PRD (ED0010216)
Slide10Scrape and collimate the beam; Read collimated current from the scraper jaws to measure halo; Detect an increase of the current above a user-specified level (accident detection)Physics Requirements (ED0010230) : WFE ScrapersSep 21, 202010M.A. Ibrahim | BCM Preliminary Design Review
Key Parameter
Value
Bias
0 to +100 V
Maximum readout current
100
A
Resolution of beam current readout
1
A
LEBT Scraper
MEBT Scrapers
*Locations Provided in PIP-II Parameters PRD (ED0010216)
Slide11Measure instantaneous current of pulsed beam, relative to a beam event, for SCL tuning, operations, and MPSPhysics Requirements (ED0010230) : Other InvasiveSep 21, 202011M.A. Ibrahim | BCM Preliminary Design Review
Key Parameter
Value
Beam pulse length
DC to 550µs
Intensity resolution
±1 %
EID
EID
EID
EID
LEBT
Absorbers
Chopper
Dump
Chopper Collimator
Kicker Protection Electrodes
Kicker Protection ElectrodesMEBT AbsorberDPI*Locations Provided in PIP-II Parameters PRD (ED0010216)
Slide12Interface Control Document Overview (ED00010433)Sep 21, 202012M.A. Ibrahim | BCM Preliminary Design Review
Slide13Pickup refers to the detector in the enclosure.Analog conditioning refers to components from the detector output to the analog-to-digital converter (ADC). “Vendor electronics” are paired only with each DCCT or ACCT pickup.It provides conditioned signals to MPS.Digital components include both firmware and software modules between the ADC and the control system input.Only RWCM will be instrumented with a scope.DSP for MPS algorithms is not within the scope of BCM system.“DSP Firmware” modules handle digitization and producing requested waveforms or measurements.“DAQ Software” modules handles transferring data from firmware to client applications in the Control System.Non-Invasive BCM System Interfaces13
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M.A. Ibrahim | BCM Preliminary Design Review
Analog Conditioning
DSP Firmware
Control System
Machine Protection System
Clock/ Timing System
Infrastructure
DAQ Software
PICKUP
Calibration System
Vendor Electronics
Scope
Beam Line
Slide14Analog ConditioningControl SystemMachine Protection System
Infrastructure
DAQ Software
PICKUP
HV Power Supply
Beam Line
Firmware
Pickup refers to an “electrode”, which part of a larger assembly in the enclosure.
All requirements for the attached assembly, including mechanical interfaces and motion control, is not within scope of the BCM system
.
Analog conditioning refers to components from the detector output to the DAQ.
It provides conditioned pickup signals to MPS and to Control System (
PiRM
)
Bias voltage will be applied to the electrode to suppress secondary e- emission and control neutralization of beam space charge
Digital components include firmware and software modules to provide remote status and control via the control system
Bias voltage will be remotely adjustable by authorized user.
Bias voltage will be remotely monitored.Invasive BCM System Interfaces14Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review
Slide15Technical Requirement Specifications (ED0013712)Sep 21, 202015M.A. Ibrahim | BCM Preliminary Design ReviewSpecification
Type
Applies Only
to
NonInvasive
Applies Only
to Invasive
Applies Only
to Both Systems
Total
Performance
5
11
0
16
Physical
Characteristics
1701229Reliability, Maintainability, and Availability61310Environmental Conditions1023Transportability2024Firmware/ Software61310Safety2136
Slide16DCCT & ACCT Systems at PIPII-ITSep 21, 202016M.A. Ibrahim | BCM Preliminary Design Review
Sync
Sync
Delay
Channel
Delay
Digitizer
Armed
Integration
Starts
Chopper
Gate
Pulse Integration
Baseline Integration
Baseline
Correction
Data Ready
Data Holds
Until Next Pulse
Beam
Signal
Beam Intensity
Counts
Pulse Width
Gate Width
Full-Scale = 10mA
Pulse Width = 10us- 15ms
Rep Rate = 20Hz, max
>5% errors due to droop for pulses >3ms
Slide17PIPII-IT DCCT Systems17Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review
(<
15mA)
Ion source & LEBT
30 keV
(
<
10mA) RFQ
(10mA x 0.55ms x 20Hz)
MEBT
2.1 MeV
HWR
10 MeV
DCCT-L
DCCT-M
Manual cites +/-100uA absolute accuracy.
Observed P:LSHDCC +/-150uA absolute accuracy.
Observed P:FSHDCC +/-50uA absolute accuracy.NPCT-CF2"3/4-34.9-120-UHV-HR-H-316LN DN/NW40CF< 1μ Arms/sqrt(Hz) resolution
Slide18PIPII-IT ACCT Systems18Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design ReviewACCT-CF2.75"-34.9-70-UHV-H -316LN -SH4L -CAWcustom 2.75" conflat flange design
(<
15mA)
LEBT
30 keV
(
<
10mA) RFQ
(10mA x 0.55ms x 20Hz)
MEBT
2.1 MeV
HWR
( 2mA x 0.5mms x 20Hz)
SSR1
HEBT
22 MeV
10 MeV
ACCT-LACCT-M1ACCT-M2ACCT-HObserved +/-1% accuracy with avg Dynamic Range : 0-10mAPulse Width : 10µs – 550µs
Slide19RWCM Systems at PIPII-IT19Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review
RFQ
Inner Diameter: 1.375”
Bandwidth : 8.2MHz -8GHz
Gap Impedance: 2.36
Ω
Extinction is calculated by comparison of integrated beam current in the filled and empty buckets
Varying Booster patterns with the HEBT RWCM
1p9c pattern with optimum tuning with the HEBT RWCM
Slide20Invasive BCM Systems at PIPII-ITSep 21, 202020M.A. Ibrahim | BCM Preliminary Design Review
Slide21PIPII-IT Biasing Electronics for Invasive BCM Systems21Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review
Measure up to 12mA
Resolution of 5uA (1uA with avg)
Current accuracy of ±1%
Bias Voltage adjustable from pot on front panel from 0 to +100V
Slide22PIPII-IT mechanical schematics for DCCT,ACCT, & RWCM is basis for PIPII pickupsVendor electronics shall be installed in the galleryPIP-II design will utilize MTCA.4 architecture.PIP2IT Transition Boards will be the basis for Analog Rear Transition CardPIP2IT Firmware will be the basis for algorithms for FPGA DSPA Distributed Data Communications Protocol (DDCP) will be used to communicate over Ethernet to the Control System.PIP2IT BPM DAQ Software will be the basis for PIP2 designPIP-II Design : Noninvasive BCM System
22
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M.A. Ibrahim | BCM Preliminary Design Review
Slide23Schematics for electronics used at PIPII-IT will provide basis for PIP-II designs.PIP-II design will utilize a Raspberry Pi Controller will provide remote control and monitoring of bias voltage over Ethernet.DDCP, based on PIP2IT BPM DAQ, will be used to communicate over Ethernet to the Control SystemPiRM (possible PIPII replacement for HRM) is outside scope of BCM.PIP-II Design : Invasive BCM System23
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M.A. Ibrahim | BCM Preliminary Design Review
Slide24Mechanical schematics for PIPII-IT DCCT,ACCT, & RWCM as well as their mounting fixtures will be reused for PIPIINeed to modify for proper mating with PIPII beamlineNeed to replace material for stand support pieces will be placed accidentally grounding through girderInvasive pickups will be reinstalled at PIPII WFEVendor electronics for ACCT and DCCT should be installed in galleryHEBT ACCT Electronics chassis will be reused.Maximum cable length without degradation of the ACCT specifications is 20 meters. (In conversation with Bergoz)Electrical schematics for transition board to conditioning and distribute signals will be reused for PIPII Need to migrate into MCTA form factor and add proper connector interfaces to MCTA back planePath to Final Design
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M.A. Ibrahim | BCM Preliminary Design
Slide25Electrical schematics for biasing electronics board to measure and distribute signals will be reused for PIPIINeed to add crate controller card and firmware/software interfaceNoninvasive BCM firmware, including integration, automated integrated window, baseline correction algorithm, will be reused for PIPIINeed to migrate into MTCA AMC Front CardMerge other firmware developments to allow DCCT readoutFurther studies of droop correction algorithmDAQ Software will be common shared resource for BIEPICS migration issues will be resolved as DDCP protocol and MTCA platform evolve and standardizedPath to Final Design
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M.A. Ibrahim | BCM Preliminary Design
Slide26Physics Requirements, Functional Requirements, Technical Requirements and Interfaces are documented and well-understood.BCM system components ( mechanical schematics, electrical schematics, firmware, and software) used at PIPII-IT will provide the basis and guidance for PIPII designs.Path to completing final design is understood.SummarySep 21, 202026M.A. Ibrahim | BCM Preliminary Design Review
Slide27Appendix APhysics Requirement DocumentDocument # : ED0010230Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review27
Slide28Physics Requirements (ED0010230) : DCCTSep 21, 202028M.A. Ibrahim | BCM Preliminary Design ReviewParameter
Value
Intensity resolution (rms)
<1 mA / sqrt(Hz)
Intensity accuracy
±0.1%
Time response
DC to 10 kHz
Min Beam aperture (WFE / SCL / BTL)
30 mm / 50 mm / 50 mm
Approx. slot length
120 mm
Operational temperature
+15
ºC
to +30
ºC
Temperature coefficient <0.5 µA/ºC typical
Slide29Physics Requirements (ED0010230) : ACCTSep 21, 202029M.A. Ibrahim | BCM Preliminary Design ReviewParameter
Value
Intensity resolution (rms)
1.5 µA
Intensity accuracy
±1%
Bandwidth
3 Hz to 1 MHz
Min Beam aperture (WFE / SCL / BTL)
30 mm / 50 mm / 50 mm
Approx. slot length
40 mm
Operational temperature
+15
ºC
to +30
ºC
Slide30Physics Requirements (ED0010230) : RWCMSep 21, 202030M.A. Ibrahim | BCM Preliminary Design ReviewParameter
Value
Bandwidth (MHz)
0.01 to 4000 MHz
Min Beam aperture (WFE / SCL)
30 mm / 50 mm
Approximate slot length (mm)
50 mm
Operational temperature
+15
ºC
to +30
ºC
Slide31Physics Requirements (ED0010230) : WFE ScrapersSep 21, 202031M.A. Ibrahim | BCM Preliminary Design ReviewParameter
Value
Beam energy
2.1 MeV
Beam diameter, rms., typ.
1 to 4 mm
Average Maximum Beam Power
75 W per plate / 200 W total
Transverse positioning resolution
200 mm
Transverse positioning accuracy
1 mm
Stroke size for each jaw
15 mm
Current read out from each jaw
Yes
Bias0 to +100 VMaximum readout current100 AResolution of beam current readout1 ADesirable typical scan time <5 minOperational temperature+15 to +30 ºC
Slide32Physics Requirements (ED0010230) : Other InvasiveSep 21, 202032M.A. Ibrahim | BCM Preliminary Design ReviewParameter
Value
Beam energy (LEBT/MEBT)
30 KeV / 2.1 MeV
Beam pulse length
DC to 550µs
Intensity resolution
±1 %
Intensity accuracy
NA
Beam Aperture
30 mm / 50 mm
Operational Temperature
+15ºC to +30ºC
Slide33PIP-II Parameters PRD (ED0010216)33Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review
Instrument
WFE
Linac (to SA dump)
BTL
Totals
DCCT
3
1
0
4
ACCT
3
3
2
8
RWCM
1102BPM – warm, 1.25”110011BPM – cold 037037BPM – warm, 2”0205878BPM – large aperture0011Laser Wire1120
13
Wire Scanner
2
2
22
26
Emittance Scanner – Allison
6
0
0
6
Emittance Scanner – Laser
0
0
1
1
Scraper – paddles
16
0
0
16
EID – non-ring
14
0
0
14
EID – ring pickups
4
0
0
4
Longitudinal – Feschenko
0
1
0
1
Longitudinal – Laser
1
0
0
1
BLM – ion
0
54
58
112
BLM – PMT
8
63
0
71
BLM – neutron
4
48
0
52
Multiwire
0
1
1
2
Halo Ring
0
1
1
2
Slide34Appendix BTechnical Requirement SpecifcationDocument # : ED0013712Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review34
Slide35Requirement #Requirements Statement : Performance (Green – NonInvasive Only ; Red – Invasive Only; None – Both)T-ED0013712-A001
Noninvasive BCM pickups shall have 10V/15mA sensitivity to average beam currents.
T-ED0013712-A002
Noninvasive BCM pickups shall withstand maximum instantaneous peak currents of 2A.
T-ED0013712-A003
ACCT BCM pickups shall have al minimum useable rise time of 0.5µsec.
T-ED0013712-A004
DCCT BCM pickups shall have a minimum useable rise time of 50µsec.
T-ED0013712-A005
RWCM BCM pickups shall have a minimum useable rise time of 1nsec.
T-ED0013712-A006
The bias voltage shall not vary more than ±3% of the setting value when adjusted to between +40V to +100V.
T-ED0013712-A007
Each electrode shall have a uniquely adjustable bias voltage.
T-ED0013712-A008
Each bias voltage shall be adjustable from 0 to +100V.
T-ED0013712-A009
Each bias voltage shall be remotely adjustable by authorized users. T-ED0013712-A010The current monitor analog signals shall be capable of measuring DC current.T-ED0013712-A011The current monitor analog signals shall have a minimum bandwidth of 350KHz.T-ED0013712-A012Each electrode shall have an analog current signal to be used by the MPS.T-ED0013712-A013The MPS analog signal shall be scaled to ±1V into 50 ohms.T-ED0013712-A014Each electrode shall have an analog current signal to be used for the purpose of BI.T-ED0013712-A015The BI analog signal shall be scaled to ±10V into an impedance ≥ 50Kohms.T-ED0013712-A016The electronics shall be capable of measuring a maximum current of 12mA.
Performance Specifications
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M.A. Ibrahim | BCM Preliminary Design Review
Slide36Requirement #Requirements Statement : Physical CharacteristicsT-ED0013712-B001All in-flange BCM pickups shall be UHV compatible and comply with the vacuum requirements described in the PIP-II Vacuum PRD [6].T-ED0013712-B002
BCM pickups shall have the capability for local particle free installation at the connecting flange points and have minimal particle production during operation, as defined in the PIP-II Vacuum PRD [6] .
T-ED0013712-B003
BCM components shall be constructed from radiation-resistant materials to withstand the radiation levels for given enclosure locations.
T-ED0013712-B004
BCM cable runs should follow the most direct path from the pickup to the nearest penetrations via grounded cable trays.
T-ED0013712-B005
BCM cables should not share conduits with magnet power supply or high power RF cables.
T-ED0013712-B006
BCM cables should pass through metallic electrical conduits, if the cable path is in a high RFI environment.
T-ED0013712-B007
BCM systems shall comply with general occupancy requirements.
T-ED0013712-B008
BCM systems should be provided rack space in a “low-noise” area of the gallery.
T-ED0013712-B009
BCM electronic chassis shall be designed for mounting in a 19” rack based on EIA-310.
T-ED0013712-B010
BCM electronic chassis shall not have a depth greater than 18”.T-ED0013712-B011BCM systems shall include circuity to distribute analog signals to the MPS.T-ED0013712-B012BCM systems shall receive signals from the Global Clock and Timing system for event-based triggering and synchronization.T-ED0013712-B013The current transformer and ceramic break for non-invasive BCM pickups shall be embedded in a pair of flanges, which will have a shape and bolt pattern compatible with adjacent beam line section.Physical Characteristics SpecificationsSep 21, 202036M.A. Ibrahim | BCM Preliminary Design Review
Slide37Requirement #Requirements Statement : Physical CharacteristicsT-ED0013712-B014Non-invasive BCM Pickup shall not have inner diameters less than the pipe apertures specified in PIP-II BI PRD [7].
T-ED0013712-B015
Flange-to-flange lengths of non-invasive BCM pickups shall not exceed slot length specified in PIP-II BI PRD [7].
T-ED0013712-B016
DCCT & ACCT components shall be constructed from corrosion-resistant materials and/or be protected with corrosion-resistant coatings.
T-ED0013712-B017
DCCT & ACCT pickups shall incorporate magnetic shielding to minimize errors induced by other near beamline components.
T-ED0013712-B018
Load-bearing support structures shall be provided to mechanically support and electrically isolate the non-invasive BCM pickups from the vacuum beam pipe.
T-ED0013712-B019
Feedthroughs for BCM cable connections shall remain accessible in the installed configuration.
T-ED0013712-B020
All cables for non-invasive BCM systems should not share conduits and cable trays with high voltage cables.
T-ED0013712-B021
One calibration cable shall be run between the BCM electronics rack and each DCCT or ACCT pickups.
T-ED0013712-B022
One signal cable shall be run between the BCM electronics rack and each WCM pickup.
T-ED0013712-B023A vendor-assembled cable shall be run between the DCCT or ACCT pickup and vendor-assembled electronics chassis.T-ED0013712-B024Placement of vendor-assembled electronics chassis in the beam enclosure should be avoided.T-ED0013712-B025BCM electronics shall have an input sampling clock of at least 10MSPS.T-ED0013712-B026BCM electronics shall digitize non-invasive pickup signals with resolution of at least 14 effective number of bits (ENOB).T-ED0013712-B027BCM electronics shall provide status indicator for successful power up.T-ED0013712-B028BCM electronics shall provide status indicators for the Ethernet communication link.T-ED0013712-B029BCM electronics shall provide status indicators for connectivity to the Clock and Timing systems.
Physical Characteristics Specifications
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Slide38Requirement #Requirements Statement : Reliability, Maintainability, and Availability(Green – NonInvasive Only ; Red – Invasive Only; None – Both)T-ED0013712-C001All printed circuit boards (PCBs) shall meet IPC2221B standard. All wiring and chassis design shall meet UL61010 standard.
T-ED0013712-C002
BCM systems shall have a capability to be manually calibrated without requiring entry into the enclosure.
T-ED0013712-C003
Certified calibrations and servicing of BCM calibration equipment shall be performed regularly and tracked in a database.
T-ED0013712-C004
Absolute accuracy of ACCT & DCCT systems shall be determined at least once a year with a reproducible calibration procedure.
T-ED0013712-C005
Relative accuracy of RWCM systems to the ACCT&DCCT systems shall be determined at least once a year with a reproducible procedure.
T-ED0013712-C006
BCM system shall provide standard interfaces for troubleshooting and programming firmware and software components.
T-ED0013712-C007
Vendor-assembled DCCT and ACCT components requiring maintenance or repair shall be returned to the vendor via a US distributor for service or modifications.
T-ED0013712-C008
Vendor-assembled DCCT and ACCT components shall have unique serial numbers.
T-ED0013712-C009
Warranty policy on vendor assembled DCCT & ACCT components shall be provided by the vendor.
T-ED0013712-C010The current monitor analog signals shall measure current to an accuracy of ±1% against a calibrated test current source.Reliability, Maintainability, and Availability SpecificationsSep 21, 202038M.A. Ibrahim | BCM Preliminary Design Review
Slide39Requirement #Requirements Statement : Environmental Conditions(Green – NonInvasive Only ; Red – Invasive Only; None – Both)T-ED0013712-D001BCM pickups shall not operate at the temperatures above 100ºC in the PIP-II enclosure.
T-ED0013712-D002
BCM electronics shall be able to operate within the environmental conditions of the gallery.
T-ED0013712-D003
Neither the DCCT nor ACCT pickups shall not be baked or operated at temperatures exceeding 100°C (212°F).
Environmental Conditions & Transportability Specifications
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M.A. Ibrahim | BCM Preliminary Design Review
Requirement #
Requirements Statement : Transportability
(Green –
NonInvasive
Only ; Red – Invasive Only; None – Both)
T-ED0013712-E001
Connections within BCM electronics shall be designed to withstand normal transport and handling acceleration and loads.
T-ED0013712-E002
BCM chassis shall be sturdy enough to handle transport shocks and not require special handling when being moved.T-ED0013712-E003Special handling shall prevent physical damage (cracks, scrapes, etc.) of BCM pickup assemblies.T-ED0013712-E004A US-based distributor shall handle all logistics regarding shipping of DCCT & ACCT from the overseas vendor to Fermilab.
Slide40Requirement #Requirements Statement : Firmware/Software(Green – NonInvasive Only ; Red – Invasive Only; None – Both)T-ED0013712-F001All beam current measurements from BCM systems shall be provided to the Control System over Ethernet.
T-ED0013712-F002
BCM systems shall comply with Ethernet network requirements.
T-ED0013712-F003
BCM systems shall include data acquisition and storage components to achieve archival and plotting rates of client applications in the Control System.
T-ED0013712-F004
BCM system settings shall be restorable after a reboot of the system.
T-ED0013712-F005
BCM systems shall decode signals from Global Clock System.
T-ED0013712-F006
BCM systems shall provide adjustable parameters, including but limited to channel delay, gating width, and filter coefficients, for customized configuration.
T-ED0013712-F007
BCM systems shall be able to store digitized waveforms in memory.
T-ED0013712-F008
BCM systems shall be able to retrieve digitized waveforms from memory.
T-ED0013712-F009
Waveform data from RWCM shall be saved into files to be used by offline analysis and graphic tools.
T-ED0013712-F010Each bias voltage shall be monitored and read out through the Control System.Firmware/Software SpecificationsSep 21, 202040M.A. Ibrahim | BCM Preliminary Design Review
Slide41Requirement #Requirements Statement : Safety(Green – NonInvasive Only ; Red – Invasive Only; None – Both)T-ED0013712-G001BCM components shall have no electrically live parts which could expose workers to unintentional electrical contact.
T-ED0013712-G002
BCM electronics shall be operated from the mains power supply and ultimately grounded by way of the grounding conductor in the power cord.
T-ED0013712-G003
BCM equipment shall be operated from the mains power supply and ultimately grounded by way of the grounding conductor in the power cord.
T-ED0013712-G004
Cover panels for vendor-assembled chassis shall not be removed while it is powered on.
T-ED0013712-G005
Vendor-assembled DCCT should not be operated without the cover panels properly installed.
T-ED0013712-G006
Each electrode shall have a protection device on the detector, removable only with a tool, to prevent electrical charge up if a cable is disconnected from the analog electronics chassis during beam operation.
Technical Requirement Specifications
(ED0013712)
Sep 21, 2020
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M.A. Ibrahim | BCM Preliminary Design Review
Slide42BackUp SlidesNoninvasive BCM SystemsSep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review42
Slide43Bergoz NPCT : https://www.bergoz.com/wp-content/uploads/NPCT-CF2%EF%80%A03%EF%80%A24-34.9-120-UHV.pdf( https://www.bergoz.com/wp-content/uploads/NPCT-CF4%EF%80%A01%EF%80%A22-60.4-120-UHV.pdf )Bergoz ACCT :https://www.bergoz.com/wp-content/uploads/NPCT-CF2%EF%80%A03%EF%80%A24-34.9-120-UHV.pdfhttps://www.bergoz.com/wp-content/uploads/NPCT-CF4%EF%80%A01%EF%80%A22-60.4-120-UHV.pdfF10068860--; RWCM, SCL Style, AssemblyThe overall model for PIP2IT’s beam line is Team Center number F10001776-BEAMLINE ASSY, PIP2IT.WFE: F10001762-A;1-LEBT ASSY, PXIE (attached)F10001763--;1-MEBT ASSY, PXIE (attached)F10112970--; WFE NPCT StandF10091216--; WFE ACCT StandF10089462--; RWCM StandHEBT, which covers the HWR and SSR1 and the diagnostic sections & dump are in: F10001768--;1-HEBT AND DIAGNOSTIC ASSY, PIP2ITF10130129--;HEBT ACCT stand assembly F10130129
List of PIPII-IT Mechanical Schematics
Sep 21, 2020
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M.A. Ibrahim | BCM Preliminary Design Review
Slide44DCCT-L measures and controls source currentACCT-L vs ACCT-M1 controls the loss in RFQACCT-M2 vs ACCT-H controls the loss in SRFACCT-H vs Dump controls the loss in HEBTDCCT-M controls the average current (averaged over 50 ms) that goes into SRFACCT-M2 controls the maximum charge over pulse : 2mA x 0.55 ms PIPII-IT Noninvasive BCM Locations9/21/2021Presenter | Presentation Title44
(<
15mA)
Ion source & LEBT
30 keV
(
<
10mA) RFQ
(10mA x 0.55ms x 20Hz)
MEBT
2.1 MeV
HWR
( 2mA x 0.5mms x 20Hz)
SSR1
HEBT
Dump
22 MeV
10 MeVDCCT-LACCT-LDCCT-MACCT-M1ACCT-M2ACCT-H
Slide45LEBT DCCT was in-air Bergoz MPCT model. To improve resolution, the mounting hardware was improved by changing AL housing to steel as well as additional analog signal conditioning in the transition board, before the HRM and digitizer. The observed accuracy was +/-150uA.MBET DCCT was in-flange Bergoz NPCT model. This model already included magnetic shielding as well as ceramic break. Bergoz also worked with MSD and Instrumtnetion to meet mechanical requirements. The output signal was integrated it with a slow leaky integrator analog circuit (~0.5-1 sec time constant).DC Current Transformers (DCCT-L and DCCT-M)
Slide46The configuration for ACCT -L and –M1 were based on Pearson CT 7655 model. The CT7655 was chosen for its wide bandwidth and physical shape. However, it has only 0.1V/A sensitivity. Its resolution was improved by 1) using a composite amplifier 2) add chokes 3) incorporation additional signal conditioning in the transition board.The configuration for ACCT –M2 and –H were based on Bergoz ACCT in-flange models. These included magnetic shielding as well as offered a wider bandwidth, slower droop rate, and better 60 Hz rejection than the CT7655. The electronics for ACCT-H was also installed in a chassis, which help improved EMI immunity.AC Current Transformers (ACCT-L/ -M1/ -M2 / -H)
Slide47Preliminary Error Analysis w.r.t. Droop RateSep 21, 202047M.A. Ibrahim | BCM Preliminary Design Review
Slide48Gap impedance: 2.36 ohms (measured).Output loss: -26.5 dB.Inside diameter: 1.375”Low frequency cutoff: 8.2MHz (measured).High frequency response: 8GHz (measured). Mixed ferrite: MK MAGNETICS STX2371M1T-B Finemet tape wound core. Ceramic Magnetics C2025
PIP2IT RWCM
48
Sep 21, 2020
M.A. Ibrahim | BCM Preliminary Design Review
Slide49PIP2IT, MEBT and HEBT wcm gap assembly showing the PCB wrapped around the ceramic break with the resistors and output cable.PIP2IT, MEBT and HEBT wcm assembly showing insides with ceramic gap assembly and ferrites.PIP2IT WCM Pickup Assembly49Sep 21, 2020
M.A. Ibrahim | BCM Preliminary Design Review
Slide50PIP2IT, MEBT and HEBT RWCM low frequency response measured with the Network Analyze, using a 50 ohm coaxial thru test setup.PIP2IT, MEBT and HEBT wcm high frequency response measured with the Network Analyzerusing a 50 ohm coaxial thru test setup.PIP2IT WCM Pickup Frequency Response50Sep 21, 2020
M.A. Ibrahim | BCM Preliminary Design Review
Slide51BackUP SlidesInvasive BCM SystemsSep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review51
Slide52Electrodes inside the vacuum chamber come into contact with beam currentRead currentsBeam tuningMPS to protect from beam damageBias voltageSuppress secondary electron emissionAlso, in LEBT controls flow of secondary ions neutralizing beam space chargeInvasive BCM System Background
Slide53Protect module from damage when an electrode is shorted to ground.The ProblemLarge power dissipation across the feedback resistorThe SolutionUtilize current limiting resistor of power ampCustom heatsinks for feedback resistorsA Topology BenefitWhen electrode is shorted to ground the circuit will max out (but not break) giving indication of a shorted electrodeProtection Resistor within Invasive BCM systems
Slide54The Issue:One of the challenges of the biased current readout electronics is dynamic range. For PIP2 we need to measure full beam currents of 12mA down to 1uA. Or said another way, we need to resolve a part in 12,000.The Data:We demonstrated that level of performance with the electronics designed and used at PIP2IT. An example can be seen from elog data taken on April 10, 2021 while operators were doing MEBT kicker characterization studies.For the test, a scraper paddle was fully inserted in the beam pipe to measure beam current passing beyond the MEBT absorber. The main point demonstrated here is that the operator could resolve to the ~1uA level how much beam current was hitting the scraper when the corrector magnet current was changed.The following plots show beam current on the scraper in mA on the vertical axis and corrector magnet current in Amps on the horizontal axis. One plot is with averaging the other is without.PIP2IT Performance of Invasive BCM Electronics54Sep 21, 2020M.A. Ibrahim | BCM Preliminary Design Review
Sasha’s
elog
comment, “…the passing current is likely <2
microA
…”
No Averaging
Averaging of 5