PPT-Memory-centric System Interconnect Design

with Hybrid Memory Cubes Gwangsun Kim John Kim Korea Advanced Institute of Science and Technology Jung Ho Ahn Jaeha Kim Seoul National University Memory Wall Core count Moores law 2x in 18 months. 9 10 11 12 13 12481632 Performance normalized to 1MB LLC size MB 04 06 08 10 0 64 128 192 256 Percore Performance normalized to 1 core Number of cores 64 128 192 256 0 64 128 192 256 Chip Performance normalized to 1 core Number of cores brPage 4br br Avg Access Time 2 Tokens Number of Controllers Average Access Time clock cyles brPage 16br Number of Tokens vs Avg Access Time 9 Controllers Number of Tokens Average Access Time clock cycles brPage 17br brPage 18br Jouppi Marco Fiorentino Al Davis Nathan Binkert Raymond G Beausoleil Jung Ho Ahn University of Wisconsin Madison HewlettPackard Laboratories University of Utah Abstract We expect that manycore microprocessors will push per formance per chip fro Interconnect and Clocks. Chapter Outline. Trends and bounds. An OSI approach to interconnect optimization. Physical layer. Data link and MAC. Network. Application. Clock distribution. ITRS Projections. Proposal. Bob Ross, . Teraspeed. Labs. bob@teraspeedlabs.com. EPEPS 2015 IBIS Summit. San Jose, CA, October 28. , 2015. Draft Presented September 2, 2015 at the Interconnect Working Group. Copyright 2015 . . Requirements. Chen Zhao, Frank Yang. NetApp, Inc.. Storage Interconnect Requirements. Multi-destination RMA operation with reliable unconnected transport. 2. www.openfabrics.org. Storage Interconnect Requirements. Through Communication-Based Design. Veronica . Eyo. Sharvari. Joshi. System on chip. Overview . Transition from Ad hoc System On Chip design to Platform based design. Partitioning the communication design into layers using the “network on chip” approach. An Open-Source Predictive Process Design Kit for 15nm . FinFET. Technology . Kirti. . Bhanushali. , . . W. . Rhett Davis (NCSU. ). International Symposium on Physical Design. April 1. , 2015. NC STATE . Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack. Slide . 1. Part V. Memory System Design. Feb. 2011. Computer Architecture, Memory System Design. Slide . 2. About This Presentation. This presentation is intended to support the use of the textbook . Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack. Satoko . Horiyama. MIURA. Satellite Applications and Operations Center. JAXA. Target Software. Data Processing Software for EO Satellites. MOS. JERS-1. ADEOS. ADEOS-II. TRMM/PR. Aqua/AMSR-E. ALOS. GOSAT. Suzanne Pauley, . eMichigan. Director. Caleb Buhs, Public Information Officer. Ottawa County Innovation & Technology Forum. April 28, 2017. Executive Promise. Source: . govtech.com. /. pcio. /. Michigans. Adeetya's Kitchen & Furniture in Pune offers exquisite handmade furniture designs with superior craftsmanship and modern, stylish appeal. https://adeetyas.com/factory-made-furniture-design-in-pune.php