PPT-Development of n-in-p large-area silicon microstrip sensors

Y Unno for the ATLAS12 sensor community and Hamamatsu Photonics KK 201393 HSTD9 Y Unno 1 ATLAS Tracker Layouts Current inner tracker Pixels 512 cm Si area 27 m 2 IBL2015 33 . However extensive research has provided numerous approximate modelling techniques which are adequate for many design purposes The following are a collection of some of the more useful formulae for microstrip circuit design 1 EQUATIONS FOR MICROSTRIP CHALLAL 12 A AZRAR 1 and D VANHOENACKER JANVIER Dept of Electronic IGEE University of Boumerdes Boumerdes Algeria mchallalgmailcom ICTEAM Electrical Engineering Universit catholique de Louvain Louvain La Neuve Belgium mouloudchallaluclouvainbe Abst Preshower. for the CMS: BARC Participation . Anita . Topkar. BARC. CMS Preshower Detector. End caps of . CMS detector has ~4300 . silicon . strip detectors covering . area . of~17 . m. 2 . . BARC . safiul_el@rediffmail AbstractPorous silicon based sensors were tested in the presence of various linear aliphatic alcohols (methanol to nhexanol) and water in the range of 10 HIGHLY SENSITIVE POROUS S 1. Introduction. The purpose of my work is to compare . two . kinds of currently commercially available photovoltaic . cells: . mc-Si and . CdTe. ,. . and . see . which will . be best for use in settlement . Prof. H. Saha IC Design & Fabrication Centre Electronics & Telecommunication Engineering Department Jadavpur University, Kolkata – 700032, India Telephone: +91 33 24146833 Telefax: +91 33 24 Sensor Requirements. Sensor requirements (consistent with IPHC development direction). ~2 cm x 2 cm (1 reticle) size.. Pixel size < 30 µm.. Integration time of ≤ 200 µs for L = 8 x 10. 27. cm. Bob . Colenutt. . Northampton Institute for Urban Affairs, University of Northampton. October 29. th. 2013. The housing shortage. Why the shortage of new market housing in the UK?. Usual reasons;. (a) Demand factors: supply of credit and lack of affordability of new units. Stave Core Assembly Status. New Thicker Stave. PS. Liverpool. 11. th. July 2013. Thicker stave to Accommodate Electrical Break. E. lectrical. break is between the skins in the core. Larger hole in the end closeout to accommodate the 3.5mm . Silicon wafer. www.guardian.co.uk. http://. mrsec.wisc.edu. en.wikipedia.org. Wafers are cut from . boules. , . which are large . logs . of uniform . silicon.. Looking at this picture, . where. do you think silicon . for the United States Department of Energy’s National Nuclear Security Administration. under contract DE-AC04-94AL85000.. Low Power Silicon . Microphotonic. Communications for Embedded Systems. Michael R. Watts. Silicon wafer. www.guardian.co.uk. http://. mrsec.wisc.edu. en.wikipedia.org. Wafers are cut from . boules. , . which are large . logs . of uniform . silicon.. Looking at this picture, . where. do you think silicon . Transmission Line, . Striplines. , Coaxial Cables & Waveguides. 2. MICROWAVE DEVICES . AND ENGINEERING. Lecture No . 3& 4. Avionics Engineering Department. Ref Material: Microwave Engineering by . Jordan . Radice. jordanra@buffalo.edu. Advanced . VLSI. Spring 2015. Dr. Ram Sridhar. Background. Moore’s Law (As we all know): Doubling of transistors every 1.5 ~ 2.0 years.. Dennard scaling works in conjunction with Moore’s law in that we maintain the overall power density of the chip area despite the exponential increase in transistors..