GEM Micromegas Resistive MSGC NEW Rui De Oliveira 7122011 1 Rui De Oliveira GEM 7122011 2 Rui De Oliveira 7122011 Rui De Oliveira 3 ID: 1045873
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1. MPGD TECHNOLOGIES AND PRODUCTIONGEMMicromegasResistive MSGC (NEW!)Rui De Oliveira7/12/20111Rui De Oliveira
2. GEM 7/12/20112Rui De Oliveira
3. 7/12/2011Rui De Oliveira3 GEM FoilPresent max size 1.2m x 0.6m Future max size 2m x 0.6m (thanks to new equipments)
4. 7/12/2011Rui De Oliveira4Base material : Polyimide 50um + 5um on both sidesDouble mask Vs single MaskBase material Hole patterning in Cu Polyimide etch Bottom electro etch Second Polyimide Etch Limited to 40cm x 40cm due toMask precision and alignmentLimited to 2m x 60cm due toBase material EquipmentDouble mask Single mask
5. 7/12/2011Rui De Oliveira5Double mask Vs single MaskSimilar patterns , similar behaviorSame materialAngles can be adjusted to application (High gain –> Charging up)
6. COMPASS6GEM double mask examplesLHCb-Muon triggerTOTEM GEMs, T. Hilden,V. Greco…WindowDrift electrodeGEM stackPad Plane Support & Media-DistributionCooling Support & LV- DistributionFront-End ElectronicShielding Cover & Read-out PlaneB. Surrow, STAR GEM7/12/2011Rui De OliveiraProduction quantities : around 500 GEMs/ year in average
7. 7GEM Single mask examplesKLOE – Cylindrical 3 GEM DetectorGEM 800mm x 500mmCMS 3 GEM DetectorGEM 1.1m x 500mm Present production rate : 100 Gem / yearExpected rate for 2012 : 250 GEM/Year 7/12/2011Rui De Oliveira
8. No spacers in active areaAssembly time ½ hour for 10cm x 10cm detector (1 technician)2 hours for 1m x 0.6m detector (1 technician)No gluing , no solderingRe opening possibleGEM exchange possibleFrame less than 10mm Final Gas test with detector assembledNew GEM stretching method (NS2) 7/12/20118Rui De Oliveira
9. No spacer self stretching structure 7/12/2011Rui De Oliveira910 to 15mmReadout connectorO-ring GEM attaching structure(4 pieces defining gaps)Drift electrodeFree to slide External screws to adjuststretching gluing
10. 7/12/2011Rui De Oliveira10FRAMEGEMHV DIVIDERDRIFT BOARDScrewsO-ringHV BNC ConnectorGas connectorsRead-out connectorsR/O BoardBottomTop
11. 7/12/2011Rui De Oliveira1130cm x 30cm
12. GEM foil tests in CO2 have been done by applying HV to each GEM and measuring the current.Nothing suspicious has been found. 7/12/201112Rui De Oliveira
13. 7/12/2011Rui De Oliveira13GEM1GEM2GEM3HVGNDDrift40mmTrimming : 0.1% relative1mA polarizing current @ 4KV4W power generation Resistor are trimmed for 2 applications:3/2/2/2 gaps3/1/2/1 gaps40 CHF/piece for 1 piece4 CHF/piece for 1000 piece
14. Micromegas 7/12/201114Rui De Oliveira
15. 7/12/201115PCBlaminationMesh depositlaminationdevelopmentRui De OliveiraMicromegas
16. Atlas CSC replacement project 7/12/2011Rui De Oliveira16MPGD Vs Wire chambers-Faster-no need for fancy gases-lower cost-robust1.2m x 0.6m
17. Resistive Bulk MicroMegas7/12/2011Rui De Oliveira17
18. 7/12/2011Rui De Oliveira18Resistive strip processPhotoimageable coverlay technique-less accurate , lower homogeneity-cracks between coverlay and resistive material trapping chemistry-Resistor adhesion problemsPCBPCBPCBPCBPCBPCBPCBPCBPCBFull PCB technique-Better resistor uniformity-Easy to clean-Thermally robust
19. 7/12/2011Rui De Oliveira19
20. Spark signal7/12/2011Rui De Oliveira2015usNo protections neededfor the amplifiers Time0.35VV on 50Ohms
21. 7/12/2011Rui De Oliveira21Atlas CSC replacement project Double sided BoardRes strip depositing BulkingTestTest before closingClosing
22. 7/12/201122Rui De Oliveira5 Bulks have been produced1Standard Bulk (S1)No production problemsDetector works3 Resistive Bulk R1 to R3 (coverlay)1 good piece (R2) Leakage current 20nA @850V2 are bad due to high leakage current1 Resistive Bulk R4 (full PCB)Immediately good at HV testunder testWe have removed the meshes for expertise of R1 and R3Atlas CSC replacement project
23. 7/12/2011Rui De Oliveira23R1Perfect stripsNo visible groovesAbsolutely flatMicro grooves between Resistor andCoverlay , Probably trapping someResidues of chemistrycoverlayResistorDark color due to KmnO4 Cleaning
24. 7/12/2011Rui De Oliveira24Correct stripsNo visible problemBut the strips are not flatDue to over cleaningR3Clear resistor delamination due to Coverlay preparation and shorter Thermal treatment
25. 7/12/2011Rui De Oliveira25X/Y read-outU/V/W read-out
26. 7/12/2011Rui De Oliveira26PCBResistive Strip 1MOhms for 1cmCopper Strip isolated+500VEmbedded resistorGNDGrounded Mesh
27. Embedded resistive protection7/12/2011Rui De Oliveira27Read-out stripEmbedded ResistorResistive material (pads down to 2mm x 0.3mm )50 to 75um
28. Resistive MSGCwork done in collaboration with Vladimir Peskov 7/12/201128Rui De Oliveira
29. 7/12/2011Rui De Oliveira29Readout linesdrift-600v0VResistive linesCoverlay
30. a)Multilayer PCB with a Cu layer on the top and one layer of readout strips on the bottom, 1mm pitchUpper Cu layer etchingThe grooves were then filled with resistive paste (ELECTRA PolymersRemoval of the CuvvvFilling withCoverlayb)c)d)e)Microdot detector manufacturing stepsvResistive anode dots 0.1mm diameterResistive cathode stripsReadout strips1mm0.1mm7/12/201130Rui De Oliveira
31. A magnified photo of Microdot detectorAnodeDotsResistivecathodestrips7/12/201131Rui De Oliveira1mm0.1mm0.7mm0.5mm0.3mm
32. Gain plotsGas gain vs. the voltage of R-Microdot measured in Ne and Ne+1.5%CH4 with alpha particles (filled triangles and squares) and with 55Fe (empty triangles and squares).7/12/201132Rui De Oliveira
33. Gain (triangles) dependence on voltage applied to R-Microdot measured in Ar (blue symbols) and Ar+1.6%CH4 (red symbols) and in Ar+9%CO2. Filled triangles and squares -measurements performed with alpha particles, open symbols - 55Fe. SQ streamers7/12/201133Rui De Oliveira
34. GEM single mask process is stableRamp up the production Increase the size to 2m x 0.6mReduce the prices Large Protected Micromegas seems OK Produce 4 2D detector end of JanuaryResistive MSGC seems attractive but:Needs more measurementsNeeds more understandingConclusions and next steps7/12/201134Rui De Oliveira
35. Thank you7/12/2011Rui De Oliveira35GEM: double or single mask1 to 4 GEMSRead-out: 1D , 2D ,3D ,Pads, PixelsCompatible whith SRS electronicsGas connectionOptions:Honey-comb structureBuilt in Resistive protectionsHV divider Kit or assembledBulk MicromegasRead-out: 1D , 2D ,3D,Pads, PixelsCompatible whith SRS electronicsGas connectionOptions:Honey-comb structureResitive protectionResitive sharing layersKit or assembled
36. Voltage-Current Characteristic of the DC Electrical DischargeGas Discharge Physics, Yuri P. Raizer