PPT-Bonding Introduction for Science 10

Chemical Reactivity The reactivity of an element depends on the number of valence electrons If the outer shell of an atom already contains 8 valence electrons this means the atom has . and . Electronegativity. Presented by . Leticia Bonita Prince. Newcastle University 4. th. Year . MChem. Student. Aims of Today. Increase your understanding of bonding and electronegativity. Increase your spatial skills and awareness using software designed by the CCDC. IB Topics 4 & 14. Text:. Ch 8 (all except sections 4,5 & 8). Ch 9.1 & 9.5. Ch 10.1-10.7. My Name is Bond. Chemical Bond. PART 5: Giant Covalent Structures, Metallic Bonding & Physical Properties. Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. CA Standards. Students know . the atoms and molecules in liquids move in a random pattern relative to one another because the intermolecular forces are too weak to hold the atoms or molecules in a solid form.. What types of things bond together?. Think-pair-share with your neighbor all of the things that bond together.. Share with entire class. What would happen if the bonds didn’t hold or were weak?. Bonding. Molecular Shapes. VSEPR Theory. From a correct Lewis structure, we can get to the 3-D shape using this theory.. VSEPR stands for . v. alence . s. hell . e. lectron . p. air . r. epulsion.. The theory is based on the idea that e- pairs want to get as far away from each other as possible!. Ball-and-stick model. Molecular . Compounds. OBJECTIVES:. Distinguish. between the melting points and boiling points of . molecular. compounds and . ionic. compounds.. Molecular . Compounds. OBJECTIVES:. Chemical bonding. Chemical Bonding. Diamond. Silicon dioxide. Graphite. Ionic Bond / metallic bond / covalent bond. Nature of the bond. Physical properties . Melting point / boiling point. Electrical conductivity. IB Topics 4 & 14. Text:. Ch 8 (all except sections 4,5 & 8). Ch 9.1 & 9.5. Ch 10.1-10.7. My Name is Bond. Chemical Bond. PART 5: Giant Covalent Structures, Metallic Bonding & Physical Properties. Electrons are transferred from an atom of low electronegativity to one of high electronegativity. Anion (-) and cation ( ) formed. Opposite charges attract – called an . electrostatic force. Formula Unit. 4.4.1: Describe the metallic bond as the electrostatic attraction between a lattice of positive ions and delocalized ions. . 4.4.2. : Explain the electrical conductivity and malleability of metals. . Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. . SYFTET. Göteborgs universitet ska skapa en modern, lättanvänd och . effektiv webbmiljö med fokus på användarnas förväntningar.. 1. ETT UNIVERSITET – EN GEMENSAM WEBB. Innehåll som är intressant för de prioriterade målgrupperna samlas på ett ställe till exempel:. Nature of coordinative bond. Back-bonding. Bonding of metals to . p. -systems. Valence bond and hybridization. Each bond treated independently from the environment. Resonance concept. Impossibility to explain molecular geometries.