PPT-DRAM MARKET UPDATE November

2014 11212014 2014 DE DIOS amp ASSOCIATES ALL RIGHTS RESERVED Reproduction prohibited without prior permission 1 DRAM market entering a new phase a more normal market in 2015. Revising& November November November November PI/PDsrole November November November Novemberstatement Nikhil Nichani. Francis Perez. Business Summary. Micron Technology, based in Boise, Idaho, engages in manufacturing and marketing of semiconductor devices worldwide. The company’s product line include Dynamic Random Access Memory(DRAM), Solid-State Drive(SSD), and Flash Memory(NAND and NOR). Micron’s products are used in many electronic applications such as personal computers, memory cards, mobile phones, USB storage devices, digital cameras, and MP3 players. Micron has assembling facilities in the United States, Asia, Middle-East, and Europe, and is a major player in the international markets with strong sales in China. In May, 2010, Micron completed the acquisition of . 04/06/2015. 1. MCWG update to WMS. Joint meeting of MCWG and CWG on Tuesday, March 10. th. 4. NPRRs reviewed for credit impacts by email vote. 3. NPRRs were operational and had no credit impact. 1 NPRR, NPRR683, impacts credit. Kshitij. Sudan. , . Niladrish. . Chatterjee. , David . Nellans. , Manu . Awasthi. , Rajeev . Balasubramonian. , Al Davis. School of Computing, University of Utah. ASPLOS-2010. DRAM Memory Constraints. DRAM Scaling. Prof. Onur Mutlu. http://www.ece.cmu.edu/~omutlu. onur@cmu.edu. HiPEAC. ACACES Summer School 2013. July 15-19, . 2013. The Main Memory System. Main memory is a critical component of all computing systems. High-Bandwidth, Energy-efficient DRAM Architectures for GPU systems. GPUs Demand High DRAM Bandwidth. GPUs Demand High DRAM Bandwidth. 2008: NVIDIA Tesla GT200. 512-bits @ 2.2 . Gbps. GPUs Demand High DRAM Bandwidth. 2014. 9/30/2014. © 2014 DE DIOS & ASSOCIATES. ALL RIGHTS RESERVED. Reproduction prohibited without prior permission.. 1. Strange situation: demand is weakening while supply remains tight. Weakening PC-DRAM demand and supply mix issues in 2H14. With burgeoning demand for knitted fabrics in the global clothing and textile industry, a mounting number of manufacturers are entering the market to capitalize on lucrative business opportunities. Manufacturers are inclined toward using glass material for automotive windshield on the back of high durability and strength offered by glass. Automotive manufacturers across the globe are looking for light-weight materials to develop light-weight vehicles. This is resulting in advancement in metal coatings technology. Vinson Young. Prashant Nair. Moinuddin Qureshi. 1. MOORE’s LAW HITS BANDWIDTH WALL. 2. Moore’s scaling encounters Bandwidth Wall. 3D-DRAM MITIGATES BANDWIDTH WALL. 3. 3D-DRAM. Hybrid Memory Cube (HMC) from Micron, . Xiangyao. Yu. 1. , Christopher Hughes. 2. , . Nadathur. Satish. 2. , . Onur. Mutlu. 3. , Srinivas . Devadas. 1. 1. MIT . 2 . Intel Labs . 3. ETH Zürich. Motivation. In-package DRAM has . Vivek Seshadri. Thomas Mullins, . Amirali. . Boroumand. , Onur Mutlu, . Phillip B. . Gibbons, Michael A. Kozuch, . Todd C. Mowry. Executive summary. Problem: Non-unit . strided. accesses. Present in many applications.