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target substrate     SiO SiH o CVD is used to form SiO  layers that are much thicker in target substrate     SiO SiH o CVD is used to form SiO  layers that are much thicker in

target substrate SiO SiH o CVD is used to form SiO layers that are much thicker in - PDF document

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Uploaded On 2014-12-18

target substrate SiO SiH o CVD is used to form SiO layers that are much thicker in - PPT Presentation

can be deposited from reacting silane and oxyge n in LPCVD reactor at 300 to 500C where can also be LPCVD deposited by decomposing dichlorosilane HCl SiO SiCl 900 57471o can be LPCVD or PECVD process In the LPCVD process dichlorosilane a nd ammonia ID: 25729

can deposited from

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