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GBT Project - PPT Presentation

Paulo Moreira November 2010 CERN Outline GBT Project Status GBT project overview Radiation hard link GBT link bandwidth The GBT chipset The GBTIA The GBLD The GBT SCA The GBT Protocol on FPGAs ID: 448867

gbt cern paulo moreira cern gbt moreira paulo http proj data 120 link jitter serializer control phase test serdes

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Slide1

GBT Project

Paulo Moreira

November 2010

CERNSlide2

Outline

GBT Project Status:

GBT project overview

Radiation hard linkGBT link bandwidthThe GBT chipsetThe GBTIAThe GBLDThe GBT - SCAThe GBT Protocol on FPGAsThe E – Links:SLVS data transmission testsDriver/ReceiverThe GBT – SerDesThe GBT – SerDes ArchitectureSerializerDe-serializerPhase-ShifterLogicPower consumptionGBT Project ScheduleGLIB overview

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

2Slide3

Radiation Hard Optical Link Architecture

Defined in the “DG White Paper”

“Work Package 3-1”

Objective:Development of an high speed bidirectional radiation hard optical linkDeliverable:Tested and qualified radiation hard optical linkDuration:4 years (2008 – 2011)Radiation Hard Optical Link:Versatile link project:

Opto-electronics componentsRadiation hardness

Functionality testingGBT project:

ASIC designVerification

Radiation hardness

Functionality testing

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

3

On-Detector

Radiation Hard Electronics

Off-Detector

Commercial Off-The-Shelf (

COTS)

GBTX

GBTIA

GBLD

PD

LD

Custom ASICs

Timing & Trigger

DAQ

Slow Control

Timing & Trigger

DAQ

Slow Control

FPGA

GBT

GBT

Versatile LinkSlide4

GBT Link Bandwidth

Bandwidth:

User: 3.36 Gb/s

Line: 4.8 Gb/sGeneric data field:3.2 Gb/s (80-bits)Dedicated channels:Link control: 80 Mb/s (2-bits)Slow control channel: 80 Mb/s (2-bits)DC balance:ScramblerNo bandwidth penaltyLink is bidirectionalLink is symmetrical

Down-link highly flexible:Can convey unique data to each frontend device that it is serving

“Soft” architecture managed at the control room level

Frame Synchronization:

Redundant header

Forward Error Correction:

Interleaved Reed-Solomon double error correction

4-bit symbols (RS(15,11))

Interleaving: 2

Error correction capability:

2 Interleaving

× 2 RS

= 4 symbols  16-bitsCode efficiency: 88/120 = 73%Transmission protocol easily implemented in modern FPGAshttp://cern.ch/proj-gbt

Paulo.Moreira@cern.ch4Slide5

The GBT Chipset

Radiation tolerant chipset:

GBTIA: Transimpedance optical receiver

GBLD: Laser driverGBTX: Data and Timing TransceiverGBT-SCA: Slow control ASICSupports:Bidirectional data transmissionBandwidth:Line rate: 4.8 Gb/sEffective: 3.36 Gb/sThe target applications are:Data readoutTTCSlow control and monitoring links. Radiation tolerance:Total doseSingle Event Upsets

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

5

GBTIA

GBLD

GBTX

GBT-SCA

Frontend

Electronics

Data<119:0>

Clock<7:0>

Control<N:0>Slide6

The GBTIA

Main specs:

Bit rate 5 Gb/s (min)

Sensitivity: 20 μA P-P (10-12 BER)Total jitter: < 40 ps P-PInput overload: 1.6 mA (max)Dark current: 0 to 1 mASupply voltage: 2.5 VPower consumption: 250 mWDie size: 0.75 mm × 1.25 mmEngineers :

Ping Gui – SMU, USAMohsine Menouni – CPPM, France

Status:Chip fabricated and testedChip fully meets specifications!

Radiation tolerance proven!GBTIA + PIN-diode encapsulated in a TO Package (Versatile link project)

Future:

Version 2 will address productivity

Pad positions reworked to facilitate the wire bond operation between the package and ASIC

Mean optical power monitoring to facilitate pin-diode/fiber alignment

2.5 V supply

Migration from the LM to the DM technologies flavor

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

6Slide7

The GBLD

Main specs:

Bit rate 5 Gb/s (min)

Modulation:current sinkSingle-ended/differentialLaser modulation current: 2 to 12 mALaser bias: 2 to 43 mA“Equalization”Pre-emphasis/de-emphasisIndependently programmable forrising/falling edgesSupply voltage: 2.5 VDie size: 2 mm × 2 mm

I2C programming interfaceEngineers

:Gianni Mazza – INFN, Italy

Angelo Rivetti – INFN, ItalyKen Wyllie – CERNPing Gui – SMU, USA

Status:

Chip fabricated and tested

Chip fully functional

Performance according to specs (if corrected

for the large input capacitance of the input protection diode)

Future:

Reduce the area of the input protection diode

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch7Slide8

The GBT – SCA

GBT-SCA Main specs:

Dedicated to slow control functions

Interfaces with the GBTX using a dedicated E-link portCommunicates with the control room using a protocol carried (transparently) by the GBTImplements multiple protocol busses and functions:I2C, JTAG, Single-wire, parallel-port, etc…Implements environment monitoring functions:Temperature sensingMulti-channel ADCMulti-channel DACEngineers:

Alessandro Gabrielli – INFN, ItalyKostas Kloukinas – CERN, Switzerland

Sandro Bonacini – CERN, SwitzerlandAlessandro Marchioro – CERN, Switzerland

Filipe Sousa – CERN, Switzerland

Status

Specification work undergoing:

1

st

Draft already available

RTL design undergoingTape-out: 2011

10-bit ADC prototype submitted for fabrication in April 2010

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch8Slide9

The GBT Protocol on FPGAs

GBT-SERDES successfully implemented in FPGAs:

Scrambler/ Descrambler + Encoder/ Decoder + Serializer/CDR

FPGA Tested:XILINX Virtex-5FXT and 6LXTALTERA Stratix II and IV GXOptimization studies:Optimization of use of resources (2009)Low and “deterministic” latency (2010)Firmware:“Starter Kit” is available for download with various resources optimization schemes forStratixIIGx and Virtex5FXTAvailable soon for:StratixIVGx and Virtex6LXTLow latencyEngineers:Sophie Baron – CERN, Switzerland

Jean-Pierre Cachemiche – CPPM, FranceCsaba Soos – CERN, Switzerland

Steffen Muschter - Stockholm UniversityUsers:30 registered users from all over the world (most users from collaborating institutes)

LHC experiments, but also CLIC, PANDA, GBTVery active users are now part of the development team

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

9

Altera + opto TRx - 4.8 Gb/s

Xilinx - 4.8 Gb/sSlide10

SLVS Driver/Receiver

Receiver

Power Supply: 1.2V to 1.5V

Power Dissipation:150uW @ 320Mbs, 1.2V supply<1uW @ power downDriverPower Supply: 1.2V to 1.5 VPower Dissipation:3.1mW @ 320Mbs, 1.2 V supply<10uW @ power down

Engineer

Sandro Bonacini – CERN, Switzerland

Status:

Chip currently under testing

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

10

Electrical Specifications

Electrical Specifications

Programmable Output CurrentSlide11

E – Links: SLVS Data Transmission Tests

Scalable Low Voltage Standard (SLVS)

JEDEC standard: JESD8-13

Main features: 2 mA Differential max Line impedance: 100 Ohm Signal: +- 200 mV Common mode ref voltage: 0.2VTests on SLVS-RT chip

1 driver1 receiverVarious types of transmission media tested:

KaptonPCB

Ethernet cableTest equipmentBidirectional link

FPGAs perform pseudo-random data generation and checking

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

11

(*) PRELIMINARYSlide12

X-ray Irradiation Results

Pre-

rad

cycle-to-cycle jitter measured using a PRBS sequence generator (Agilent 81133A)is about 17 ps (rms)

All chips show a peak in the SLVS receiver supply current and then a decrease to a value smaller than the pre-rad.

SLVS transmitter supply current doesn’t change significantly with irradiation.

Chips show a worse jitter performance after irradiation

Sequence-dependence, most likely due to the receiver becoming slower for the decrease in supply

current

PMOS threshold increase responsible for bias current degradation.

New chip submitted July 2010 with a resized bias circuit

Input

from Xilinx

S3E

Input

Output

Pre-

radPost-

radSlide13

The GBT - SerDes

The GBT – SerDes is a demonstrator for:

The Serializer/De-serializer critical circuits:

Phase-Locked LoopsFrequency dividresLine driver/receiverConstant-latency barrel shifterPhase shifterThe circuit operates at 4.8 Gb/sThe chip was packaged in a custom flip-chip BGA packageEngineers:Ozgur Cobanoglu - CERN, SwitzerlandFederico Faccio - CERN, SwitzerlandRui Francisco – CERN, SwitzerlandPing Gui – SMU, USAAlessandro Marchioro - CERN, SwitzerlandPaulo Moreira - CERN, SwitzerlandChristian Paillard - CERN, SwitzerlandKen Wyllie - CERN, SwitzerlandStatus:

Chip is currently under testing

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

13Slide14

The GBT – SerDes Architecture

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

14

Serial

input

DES

Clock

Generator

Clock

reference

SER

Serial

out

Switch

Switch

120

FEC

Decoder

FEC

Encoder

De-scrambler

Header decoder

Scrambler

Header encoder

Parallel

Out/

BERT

Parallel

In/

PRBS

Control

Logic

Phase

Shifter

Switch

Switch

120

Switch

Switch

120

120

120

120

120

txDataValid

dIn [29:0]

Full custom

txClock40

txClock160

rxDataValid

dOut [29:0]

rxClock40

rxClock160

PROMPT

I2C

JTAG

AUX[n:0]

RX: 40 MHz & 160 MHz

TX: 40 MHz & 160 MHz

Data path

Clocks

Control bus

RST

rxRdy

txRdy

ClkOut3

ClkOut2

ClkOut1

ClkOut0

120

120

120

120

120

120

120

Frame

Aligner

120

Power On

RESET

resetSlide15

Serializer

Serializer:

4.8 Gb/s

120-bit shift register3 × 40-bit shift register (f=1.6 GHz)3-to-1 fast multiplexer (f=4.8 GHz)Data path:No SEU protectionSEUs handled by the Reed-Solomon CODECClock divider:Divide by 120f = 4.8 GHzTriple voted for SEU robustnessPLL:SEU hardened VCOEngineers:Ozgur Cobanoglu - CERN, SwitzerlandFederico Faccio - CERN, SwitzerlandPaulo Moreira - CERN, Switzerland

Status:Fully functional

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

15Slide16

Serializer Measurements 4.8 Gb/s (1/3)

Tx

Jitter:

Total jitter (1e-12): 53 psRandom jitter: 2.4 ps (rms)Deterministic jitter: 19 psData dependent: 4.8 psPeriodic:RMS: 4.6 psPP: 19.6 psDuty-cycle-distortion: 0.6 psInter-symbol interference: 4.8 pshttp://cern.ch/proj-gbtPaulo.Moreira@cern.ch16

More than 3 orders of magnitude

improvement due to the FEC

SNR is high, the system operates error free

SNR

relatively low

SNR very low

(noise is too high)

FEC can’t improve BERSlide17

Serializer Measurements 4.8 Gb/s (2/3)

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

17Slide18

Serializer Measurements: 6 Gb/s (3/3)

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

18Slide19

Serializer: Test Board Grounding Scheme

Electrical eye:

4.8 Gb/s

Separate digital and analogue groundsStrong low frequency jitter componentsMost jitter components below 3 MHzEasily tractable by the receiving PLLElectrical eye:4.8 Gb/sCommon digital and analogue groundsLow frequency jitter components virtually not present!http://cern.ch/proj-gbtPaulo.Moreira@cern.ch

19Slide20

De-serializer

De-Serializer:

Dual PLL CDR Loop:

1st Loop: Frequency centering PLL2nd Loop: CDRAllows to reduce the CDR VCO gain for lower JitterHalf-Rate:Phase-detectorFrequency-detectorConstant latency frame alignment circuitAs for the serializer:Unprotected data pathTMR clock dividerSEU hardened VCOEngineers:Ozgur Cobanoglu - CERN, SwitzerlandFederico Faccio - CERN, Switzerland

Rui Francisco – CERN, SwitzerlandPaulo Moreira - CERN, SwitzerlandStatus:

The receiver is fully functional Clock recovery operates up to 6 Gb/sHowever it only operates error free up to

3.0 Gb/sThis seems to be caused by the (so far unexplained) bad quality of the eye-

diagram at the input of the receiver (see later in this presentation)

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

20Slide21

CDR: Measurements

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

2140 MHz recovered clock clock

PRBS @ 4.8 Gb/s:

Total jitter (1e

-12

): 63 ps

Random jitter: 4.9 ps (rms)

Deterministic jitter: 24

ps

(pp)

Periodic:

RMS:

2

ps

PP: 5 psSlide22

De-serializer: Input eye-diagram

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

22

Signal generator eye-diagram (straight to the scope)

Empty board with a connector and a 100

W

termination (differential active probe)

Populated boardSlide23

PCB – Package Modelling (2½ D)

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

23

Package (one interconnect layer)

PCB: SFP to GBT transmission lines

Package S-Parameters

Package + PCB S-Parameters

PreliminarySlide24

Phase – Shifter

Phase-Shifter:

Main features:

8 – channels (3 in the GBT-SERDES prototype)1 PLL + Counter generates the three frequencies: 40 / 80 and 160 MHz1 DLL per channelMixed digital/analogue phase shifting technique:Coarse de-skewing – DigitalFine de-skewing – AnaloguePower consumption:PLL: 42 mW (measured)Channel: 16 mW/channel (measured)Differential non-linearity: <6.7% LSBIntegral non-linearity: INL<6.5% LSBEngineers :Ping Gui – SMU, USATim Fedorov – SMU, USAPaul

Hartin – SMU, USANataly Pico – SMU, USA

Bryan Yu – SMU, USAStatus:Fully functional

Fully meets the specsOne channel with timing problems but problem clearly identified with trivial solution

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

24Slide25

Phase – Shifter: Measurements

Resolution:

Dt = 48.83 ps Differential Non-Linearity: s = 4.7 ps (9.6% of Dt) pp = 21.5 ps (44% of Dt) Period Jitter:

s = 4.8 ps (pp = 29 ps) Integral Non-Linearity

: s = 4.3 ps (8.7% of

Dt) pp = 21.9 ps (48.7% of

D

t

)

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

25Slide26

Phase – Shifter: Measurements

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

26Slide27

Digital Functions

Digital Functions:

Parallel I/O interface MUX

Scrambler De-ScramblerEncoder decoderFrame aligner logicFrequency calibration logicI2C interfaceEngineers:Alessandro Marchioro - CERN, SwitzerlandPaulo Moreira - CERN, SwitzerlandChristian Paillard - CERN, SwitzerlandKen Wyllie - CERN, SwitzerlandStatus:Fully functionalhttp://cern.ch/proj-gbtPaulo.Moreira@cern.ch

27Slide28

GBT – SerDes Power Consumption

Circuit

Power [mW]

CDR456Serializer3303 ch Phase-Shifter (+ 2 diff. drivers = 10 mW)94 (≈ 16 mW/Ch + PLL: 42 mW)I/O

75Digital Core

27Total

980

http://cern.ch/proj-gbt

Paulo.Moreira@cern.ch

28Slide29

Project Schedule

Tasks remaining

:

GBT – SerDes:Understanding the receiver behaviour:3 Gb/s error free operation instead of4.8 Gb/sSEU testsGBTX:Receiver rework (if needed)Power down functions (SER/CDR)TX 8B/10B modeClock ManagerVXCO based PLL8 channel Phase-Shifter (only 3 on GBT - SerDes)E – LinksBi-directional C4 padSerializersPhase-AlignersControl Logic:

Watchdog and start-up state machinesIC channel logicI2C master

Configuration logic:Fuse bankChip assembly and verification

From industry:BGA package (flip-chip)80 MHz crystalTesting:

Test setup (should we use the IC tester?)

Early behavioral model needed for test development

Software

Firmware

GBLD:

Change the input protection diodes, change I/O to 1.5VGBTIAChange pad ring, add average power detector and add squelch circuit

Migration from the LM to the DM technologies flavor2.5V Supply

Project Schedule 2011

1st Q:SEU tests on GBT – SerDesGBLD submissionGBTIA submission3/4th Q: GBTX submissionhttp://cern.ch/proj-gbtPaulo.Moreira@cern.ch

29Slide30

The Gigabit Link interface Board (GLIB)

GLIB concept:

E

valuation platformEasy entry point for users of high speed optical linksIntended use:Optical link evaluation in the laboratoryControl, triggering and data acquisition of remote modules in beam or irradiation testsEach GLIB card:Can process data to/from four SFP+ transceiver modules

Each operating at bi-directional data rates of up to 6.5 Gbps

.Matches comfortably the specifications of the GBT/Versatile

Link:Target data rate of 4.8 Gbps.Basic configuration:

O

ne

GLIB

board interfaces

with up to four GBT channelsPhysical implementation:

Double width Advanced Mezzanine Card (AMC)Based

on the XC6VLX130T FPGA of the Virtex-6 familyLong lifetime:

Distribution

and support of a small set of variants over several yearsEngineering contacts:Sophie BaronFrancois VaseyPaschalis Vichoudishttp://cern.ch/proj-gbtPaulo.Moreira@cern.ch

30Slide31

GLIB Deliverables

The GLIB team envisages to deliver and

support:

SoftwareFirmwareHardware 3 Basic setups:Bench-top beam test setupBench-top front-end module test setupCrate system test setupThe required FMCs (TTC & E-Link) will also be delivered and supported.http://cern.ch/proj-gbtPaulo.Moreira@cern.ch

31

Bench-top front-end module test setup

Bench-top beam test setup

Crate system test setup

Status:

Specifications

V

1.9

available

.

Design

Schematics

:

Ready.

Layout: Ready. Verification

on-going

Fabrication:

Prototype Feb 2011

Testing:Commercial solutions will be used

Software/firmware:

Development will start in 2011