PPT-WP4: microelectronics and interconnections

WP Coordinators Christophe de la Taille Valerio Re Goal provide chips and interconnections to detectors developed by other WPs Task 1 Scientific coordination CNRSOMEGA INFNUNIBG. Wafer bumping services are offered as a preparatory step for flipchip bonding or as bumping service alone The types of solder bumping available include high lead solder eutectic solder and lead free solder Lead free bump which is composed of tins beLOw IMprOveMeNt Of First Pass SOLderiNg YieLds ReductiON iN ,abOr COsts aNd INcrease iN PrOductiON Rates ELiMiNatiON Of -etaL Surface /xidatiON IMpLeMeNtatiON Of ,Ow Residue .O CLeaN SOLderiNg Exp M .E. Microelectronics 2 Core Courses : MEL G611 IC Fabrication Technology [ 3 2 5 ] Material properties; crysta l growth and doping; diffusion; oxidation; epitax y; ion implantation; deposition of ver. 1 ME 4210: Manufacturing Processes and Engineering Prof. J.S. Colton Lecture-1 : Introduction B. Mazhari G-NumberDept. of EE, IIT Kanpu r Outline What is Microelectronics? Analog Circuits and Amplifiers Course outline G-Number What is Microelectronics? G-Number The El B. Preparation of Bumped Wafer for Dicing Additionally, a 200 mm bumped wafer with high proximity of bumps to a narrow saw street was diced as part of this study. See Figure 2 showing street proximity Bipolar transistors 3. http://www.eet.bme.hu/~poppe/miel/en/. 0. 8-bipolar3. .. ppt. x. 16-10-2014. Microelectronics BSc course, Bipolar transistors 3 © András Poppe & Vladimír Székely, BME-EET 2008-2014. Basic semiconductor physics. http://www.eet.bme.hu/~. poppe/miel/en/. 03-smicond_phys.ppt. x. 15-09-2015. Microelectronics BSc course, Basic semiconductor physics © András Poppe & Vladimír Székely, BME-EET 2008-2015. Bipolar transistors 3. http://www.eet.bme.hu/~poppe/miel/en/. 0. 8-bipolar3. .. ppt. x. 13-10-2015. Microelectronics BSc course, Bipolar transistors 3 © András Poppe & Vladimír Székely, BME-EET 2008-2014. Acquisition of IBM Microelectronics July 1, 2015 Acquires Chartered Semiconductor The GLOBALFOUNDRIES Story GLOBALFOUNDRIES Confidential 2 Creating an Industry Leader • New York fab deliver Overview. . of. . PECS . projects. European Space . Agency Information . Day. 1. 1. th. January. , 2017. Point of Contact: . Ms. . Maite. Trujillo: maite.trujillo@esa.int. Mr. Laurent . Marchand. College of Computer Science and Electrical Engineering, University of Rostock. Slide 1. Spezielle. . Anwendungen. des VLSI – . Entwurfs. . Applied VLSI design. Differences between FPGA and ASIC. ZONE. Interconnections between the 2030 Agenda for Sustainable Development and the Paris Climate Agreement . Exploring . the Role of State, Non-State and Subnational . Actors. Seizing the COP23 Moment. METIS at a glance. A Sector Skills Alliance, co-funded by Erasmus+. Lot 3: implementing a new strategic approach (“Blueprint”) to sectoral cooperation on skills. 4-year project, launched in November 2019.