PPT-Combining Pre-Silicon Verification Brains with Post-Silicon

Reviewer ShuoRen Lin 2012511 ALCom 1 Abstract Postsilicon functional validation challenges Light overhead associated with the testing procedures Highquality validation Postsilicon functional exerciser. Preshower. for the CMS: BARC Participation . Anita . Topkar. BARC. CMS Preshower Detector. End caps of . CMS detector has ~4300 . silicon . strip detectors covering . area . of~17 . m. 2 . . BARC . Localisation. using. MAX-SAT & Backbones. Georg Weissenbacher. Charlie . Shucheng. Zhu, . Sharad. . Malik. Princeton University. (Photo: Intel Press Kit). Where did things go wrong?. Intel Pentium FDIV Bug 1994. Werner Bergholz, Jacobs University Bremen. Friedrich Passek, . Siltronic. AG. Peter Wagner. Updated . October 23, 2014. Task . Forces. . with. European . Participation. Int. . Advanced. Wafer . Geometry. After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot.. ECE . 7502 Class Discussion . B. en Calhoun. Thursday January 22, 2015. Requirements. Specification. Architecture. Logic / Circuits. Physical Design. Fabrication. Manufacturing Test. Packaging Test. PCB Test. Localisation. using. MAX-SAT & Backbones. Georg Weissenbacher. Charlie . Shucheng. Zhu, . Sharad. . Malik. Princeton University. (Photo: Intel Press Kit). Where did things go wrong?. Intel Pentium FDIV Bug 1994. Hrvoje Štefančić. . Theoretical Physics Division . Ruđer Bošković Institute . (based on joint work with . Hrvoje Abraham . and . Predrag Lazić. ). Electric field strength in a segment of a Si microstrip detector. Daher . Kaiss, Jonathan Kalechstain. Formal Engines and . Technologies Team. Core CAD . Technologies. Intel Corp. . - Haifa. Agenda. Motivation. Speed path debug at Intel. Introducing our tool: NGSPA. Doowon Lee. *, Tom Kolan. †. , Arkadiy Morgenshtein. †. ,. Vitali Sokhin. †. , Ronny Morad. †. , Avi Ziv. †. , Valeria Bertacco*. * University of Michigan, . †. IBM Research − Haifa. example of processor die. Silicon wafer. www.guardian.co.uk. http://. mrsec.wisc.edu. en.wikipedia.org. Wafers are cut from . boules. , . which are large . logs . of uniform . silicon.. Looking at this picture, . where. do you think silicon . Silicon wafer. www.guardian.co.uk. http://. mrsec.wisc.edu. en.wikipedia.org. Wafers are cut from . boules. , . which are large . logs . of uniform . silicon.. Looking at this picture, . where. do you think silicon . it—Part 1. Explain . how single crystalline Si wafers are made . Describe . the crystalline structure of Si . Find . the . Miller indices. of a planes and directions in crystals and give the most important direction/planes in silicon . Jordan . Radice. jordanra@buffalo.edu. Advanced . VLSI. Spring 2015. Dr. Ram Sridhar. Background. Moore’s Law (As we all know): Doubling of transistors every 1.5 ~ 2.0 years.. Dennard scaling works in conjunction with Moore’s law in that we maintain the overall power density of the chip area despite the exponential increase in transistors.. Justius von Liebig. (1803-1873). Agronomist, chemist from Germany. He first suggested use silicon fertilizer (sodium silicate) in 1840. First greenhouse experiment was conducted on sugar beet.. . Prof. J. B. Lawes .