PPT-ETCHING

Author : yoshiko-marsland | Published Date : 2016-04-08

Università degli Studi di Roma La Sapienza CDL Ingegneria delle Nanotecnologie industriali Corso di MEMS AA 20082009 Professore Marco Balucani Ingegnere Rocco

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Università degli Studi di Roma La Sapienza CDL Ingegneria delle Nanotecnologie industriali Corso di MEMS AA 20082009 Professore Marco Balucani Ingegnere Rocco Crescenzi Studente. Abstract:. MEMS . technology consists of microelectronic elements, actuators, sensors, and mechanical structures built onto a substrate, which is usually silicon. They are developed using microfabrication techniques: deposition, patterning, and etching. The most common forms of production for MEMS are bulk micromachining, surface micromachining, and HAR fabrication. Etching . by goldsmiths and . other metal-workers in order to decorate metal items such as guns, . armour. , cups and plates has been known in Europe since . the Middle Ages at . least, and may go back to . Anatomy . Lesson of Dr. . Nicolaes. . Tulp. , . 1632.. Rembrandt, The Anatomy Lesson of Dr. Nicolas Tulp, 1632, (65 x 86 in.), Maurithuis, The Hague. Thomas de Keyser, . The Anatomy Lesson of Dr. . Sebastiaen. of 3D . structures on the micrometer . scale. Most methods use silicon as . substrate material. Some of process involved in this are photolithography, etching, bulk machining, laser machining etc.. Unit metal removal rate and equipment precision are key factors to micro machining.. isotropic. and . anisotropic etching. Explain the differences between . wet. . and . dry etching. techniques. Identify several common wet etchants and explain what they are commonly used for. Explain the difference between . Wet chemical etching: isotropic.. Anisotropic etching of crystalline Si.. Dry etching overview.. Plasma etching mechanism.. Types of plasma etch system.. Dry etching issues.. Dry etching method for various films.. 15. th. Century. . Artists scratched directly onto cast or hand-blown glass, creating designs, motifs and pictures. . -Acid etching was developed in the 1860’s and the cutting was finer and more exquisite. . 22 April 2015. Abstract. . Microelectromechanical Systems (MEMS) are devices that integrate mechanical systems with electronic circuits. Fabrication of MEMS involves the use of specialized micromachining technologies. Device packaging aims to protect from outside damage and varies drastically depending upon application. Different materials used, fabrication techniques, and packaging types will be examined.. Brought to you by: Jack Link & Aaron Schiller. Date delivered on: Friday the third of May, 2013. ABSTRACT:. Taking a brief look at MicroElectroMechanical Systems (MEMS), we will guide you through the fabrication stages and show you some applications that they are used for. MEMS can be very simple and not move at all to being immensely complex systems with lots of moving elements being controlled by the system. Starting off with some simple facts we will then show the stages of their fabrication. The basic process of manufacturing MEMS starts with deposition of thin films onto their respective material layers. Then the material is patterned by one of many forms of lithography. The final step in creating MEMS is etching the pattern so that the final product will be the desired shape. MEMS can be created at a relatively low cost because they can be produced in high volumes because of bulk fabrication. MEMS are used for microvalves for controlling gas and liquid, switches, sensors, actuators, and much more!. 22 April 2015. Abstract. . Microelectromechanical Systems (MEMS) are devices that integrate mechanical systems with electronic circuits. Fabrication of MEMS involves the use of specialized micromachining technologies. Device packaging aims to protect from outside damage and varies drastically depending upon application. Different materials used, fabrication techniques, and packaging types will be examined.. Igor Ozerov / PLANETE . / . Aix-Marseille . Univ. , CNRS, CINAM 13009 . Marseille France. 28/01/2020 meeting at CPPM. Principles of anisotropic wet etching of Silicon . Parallel vertical walls with high aspect ratio for {110} wafers !. Igor Ozerov / PLANETE . / . Aix-Marseille . Univ. , CNRS, CINAM 13009 . Marseille France. 28/01/2020 meeting at CPPM. Principles of anisotropic wet etching of Silicon . Parallel vertical walls with high aspect ratio for {110} wafers !. Astroparticle. Physics and Space Science. Bose Institute, Kolkata. Calibration of a Nuclear Track Detector (NTD) for rare event search in Cosmic Rays. Rare events (. strangelets. ) in cosmic rays. Certain phenomenological models have raised the possibility of the existence of a new kind of matter called Strange Quark Matter (SQM), containing nearly equal numbers of up, down and strange quarks, the discovery of which will be of huge significance for physics.. a simple way to reveal microstructure. . of metallic alloys. Purpose of etching is to . reveale. the microstructure of metals and alloys by creating an image contrast.. Electrolytic etching ensues right after an electropolishing operation is completed, .

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