PPT-CLICpix and MEDIPIX3-TSV projects

Author : backbays | Published Date : 2020-06-22

Pierpaolo Valerio Outline The CLIC project CLICpix design CLICpix prototype characterization TSV interconnects Conclusions 2 Outline The CLIC project CLICpix design

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CLICpix and MEDIPIX3-TSV projects: Transcript

Pierpaolo Valerio Outline The CLIC project CLICpix design CLICpix prototype characterization TSV interconnects Conclusions 2 Outline The CLIC project CLICpix design CLICpix prototype characterization. June 14. th. 2014. Prashant J. Nair - Georgia Tech. David A. Roberts- AMD Research. Moinuddin. K. Qureshi – Georgia Tech. Current memory systems are inefficient in energy and bandwidth . Growing demand for efficient DRAM memory system. Mathieu Benoit. Outline. Analysis of 150um-on-100um n-in-p assemblies. Status of submission to . Advacam. Methodology. After wire-bonding, chip is powered, sensor biased at 40V. Chip threshold equalization is performed twice, mask pattern is written to disk. Caleb Serafy and . Ankur. Srivastava. Dept. ECE, University of Maryland. 3/31/2014. 1. 3D Integration. Vertically stack chips and integrate layers with vertical interconnects. Through Silicon . Vias.  Christa Anderson. Program Manager II. Microsoft Corporation.  Niraj Agarwala. Senior Test Lead. Microsoft Corporation. ES22. Agenda. What is presentation virtualization . and why should you care?. S. IM. : A Fast,. Configurable . Memory-Reliability Simulator for Conventional and 3D-Stacked Systems*. Memory Reliability Tutorial: HPCA-2016. Prashant Nair . . . Georgia Tech. David . Roberts . . Department of Computing Sciences . September 28. , 2009. Faculty consists of both full-time and part-time members. Interests range from theoretical foundations to practical applications. Some research is sponsored. ideas and a first specification draft. P. . Valerio. The . source of the . error…. pierpaolo.valerio@cern.ch. 2. The leakage power consumption was calculated using a power measurement on a shift register using the same technology (and dividing by the number of flip-flops in the chain). Li Jiang. †. , . Qiang. . Xu. †. and Bill . Eklow. §. †. CU. hk. . RE. liable. . C. omputing Laboratory. Department of Computer Science & Engineering. The Chinese University of Hong Kong. ECE . 7502 Class Discussion . Reza . Rahimi. 10. th. Feb 2015. Requirements. Specification. Architecture. Logic / Circuits. Physical Design. Fabrication. Manufacturing Test. Packaging Test. PCB Test. June 14. th. 2014. Prashant J. Nair - Georgia Tech. David A. Roberts- AMD Research. Moinuddin. K. Qureshi – Georgia Tech. Current memory systems are inefficient in energy and bandwidth . Growing demand for efficient DRAM memory system. WITH. Duo Two-factor authentication . AND. custom identity proofing. Daniel Yee. Lead Software Developer, Temple University. Overview. Duo Two-Factor Authentication. Securing SSB resources with Duo. Deploying custom identity proofing. Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam Department of Electrical and Computer Engineering Auburn University, AL 36849 USA Thesis Advisor: x0000ABEFGHHDPQRSTUPVRWOXTYXZVWPOYVOXabTYXcYbOXVUPOdVTPVTfbOROYOgVSWhiObjklllmTOUnoVnORfbVoTSVYjkqjjdmarVPXVYOOYSPOOPOXstSaSSpuvkjwjdmoSgVSWfPOYSxfTbnVYZVWPyVRVUPOoTSVYgVSWoTbOfPOdVYZVWyPrdTPORSWTSTbO Pantoja CR, Navarro SA, Naranjo J, Lightner DV, Gerba CP. Nonsusceptibility of Primate Cells to Taura Syndrome Virus. Emerg Infect Dis. 2004;10(12):2106-2112. https://doi.org/10.3201/eid1012.040419.

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