PPT-Unit 04: BONDING IB Topics 4 & 14

Text Ch 8 all except sections 45 amp 8 Ch 91 amp 95 Ch 101107 My Name is Bond Chemical Bond PART 4 Intermolecular Forces Intermolecular Forces DipoleDipole Hydrogen Bonding . 92B is applicable to bonding at services and in part states Bonding jumpers meeting the other requirements of this article Article 250 shall be used around concentric or eccentric knockouts that are punched or otherwise formed so as to impair the ele Molecular Geometry. Ch. 6 Sections 1-4 Review. In general, what determines whether atoms will form chemical bonds?. Atoms will form a chemical bond if their potential energy is lowered in doing so.. Describe the difference between ionic and covalent bonding.. IB Topics 4 & 14. Text:. Ch 8 (all except sections 4,5 & 8). Ch 9.1 & 9.5. Ch 10.1-10.7. My Name is Bond. Chemical Bond. PART 5: Giant Covalent Structures, Metallic Bonding & Physical Properties. Molecular Shapes. VSEPR Theory. From a correct Lewis structure, we can get to the 3-D shape using this theory.. VSEPR stands for . v. alence . s. hell . e. lectron . p. air . r. epulsion.. The theory is based on the idea that e- pairs want to get as far away from each other as possible!. Higher Supported Study - Week 2 . Key Areas – Periodic Trends . The trends in . covalent radius . across periods and down groups.. The trends in . ionisation energies . across periods and down groups. . Chemical bonding. Chemical Bonding. Diamond. Silicon dioxide. Graphite. Ionic Bond / metallic bond / covalent bond. Nature of the bond. Physical properties . Melting point / boiling point. Electrical conductivity. Atoms, Orbitals & Bonding Topics:. Very quick history of chemistry…. What is organic chemistry?. Atomic models: nuclear to quantum. All . about . orbitals. How . orbitals fill: electron . configuration. “MY COUNTRY WAS NEVER SO RICH THAT IT COULD AFFORD POOR ROADS”. BUILD SUSTAINABLE ASSETS. HILL ROADS: CRITICAL ISSUES. Expensive to transport materials so i. t is imperative to use in-situ / local materials . Electrons are transferred from an atom of low electronegativity to one of high electronegativity. Anion (-) and cation ( ) formed. Opposite charges attract – called an . electrostatic force. Formula Unit. A Unique Job Placement Tool. A business insurance policy that protects the employer in case of any loss of money or property due to employee dishonesty. What is the Federal Bonding Program?. What makes this program great?. Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. Day . 6. – Venn Diagram, . haber. Process. Metallic . Bonding, Properties of Substances reading, . Warm up. ON PAGE 23. What do ionic and covalent bonding have in common? What is different?. Time: . Metallic Bond – the force that holds metal atoms together. Metals do not form covalent bonds with one another because they do not have enough electrons in their outer shells to form stable octets.. Nature of coordinative bond. Back-bonding. Bonding of metals to . p. -systems. Valence bond and hybridization. Each bond treated independently from the environment. Resonance concept. Impossibility to explain molecular geometries.