PPT-STT-RAM as a sub for SRAM and DRAM

Penn State DAC12 ISPASS13 Architecture Reading Club Spring13 1 CacheRevive Architecting Volatile STTRAM Caches for Enhanced Performance in CMPs Penn State DAC12 Architecture Reading Club Spring13. Caching Compiler Choices int x32512 forj 0 j 512 j fori 0 i 32 i xij 2xij1 int x32512 fori 0 i 32 i forj 0 j 512 j xij 2xij1 brPage 14br Caches and Consistency IO using caches Interferes with CPU may throw useful blocks IO using main m MIN. Tracking. ECE . 7502 Class . Proposal. Arijit Banerjee. 12. th. Feb 2015. Requirements. Specification. Architecture. Logic / Circuits. Physical Design. Fabrication. Manufacturing Test. Packaging Test. W. rite V. MIN. Tracking. ECE . 7502 Class . Final Presentation. Arijit Banerjee. 21. th. Apr 2015. Requirements. Specification. Architecture. Logic / Circuits. Physical Design. Fabrication. Manufacturing Test. K. . Qureshi. ECE, Georgia Tech. Gabriel H. Loh, AMD. Fundamental Latency Trade-offs. in Architecting DRAM Caches. MICRO 2012. 3-D Memory Stacking. 3-D Stacked memory can provide large caches at high . . and Architecture. William Stallings . 8th Edition. Chapter 5. Internal Memory. The two basic forms of semiconductor random access memory (RAM) are dynamic RAM (DRAM) and static RAM (SRAM). . SRAM is faster, more expensive, and less dense than DRAM, and is used for cache memory. DRAM is used for main memory.. See: P&H Appendix C.8, C.9. Announcements. HW1 due today. HW2 available later today. HW2 due in one week and a half. Work . alone. Use your resources. FAQ, class notes, book, Sections, office hours, newsgroup, . 414 – Introduction to VLSI Design. Module #7 – Storage Devices. Agenda. Sequential Logic. Memory. Announcements. Read Chapters 8 & 10. Sequential Logic. Sequential Logic. - Now we move to logic circuits whose outputs depend on:. 414 – Introduction to VLSI Design. Module #7 – Storage Devices. Agenda. Sequential Logic. Memory. Announcements. Read Chapters 8 & 10. Sequential Logic. Sequential Logic. - Now we move to logic circuits whose outputs depend on:. Power Point Slides. PROPRIETARY MATERIAL. . © 2014 The McGraw-Hill Companies, Inc. All rights reserved. No part of this PowerPoint slide may be displayed, reproduced or distributed in any form or by any means, without the prior written permission of the publisher, or used beyond the limited distribution to teachers and educators permitted by McGraw-Hill for their individual course preparation. PowerPoint Slides are being provided only to authorized professors and instructors for use in preparing for classes using the affiliated textbook. No other use or distribution of this PowerPoint slide is permitted. The PowerPoint slide may not be sold and may not be distributed or be used by any student or any other third party. No part of the slide may be reproduced, displayed or distributed in any form or by any means, electronic or otherwise, without the prior written permission of McGraw Hill Education (India) Private Limited. . ECE 4332 Fall 2013. Team VeryLargeScaleEngineers. Robert Costanzo. Michael Recachinas. Hector Soto. Outline. Problem. Design Approach & Choices. Circuit. Block. Architecture . Novelties. Layout. Simulations & Metrics. K. . Qureshi. ECE, Georgia Tech. Gabriel H. Loh, AMD. Fundamental Latency Trade-offs. in Architecting DRAM Caches. MICRO 2012. 3-D Memory Stacking. 3-D Stacked memory can provide large caches at high . Dr. . Nizamettin AYDIN. naydin. @. yildiz. .edu.tr. nizamettinaydin@gmail.com. http://. www.yildiz. .edu.tr/~naydin. 1. Internal. Memory. 2. Outline. Semiconductor. main . memory. Random. Access . Language-Directed Hardware Design for Network Performance Monitoring Srinivas Narayana, Anirudh Sivaraman , Vikram Nathan, Prateesh Goyal, Venkat Arun , Mohammad Alizadeh , Vimal Jeyakumar eDRAM. NUCA Architecture. Javier Lira (UPC, Spain) Carlos . Molina (URV, . Spain). . javier.lira@ac.upc.edu. . carlos.molina@urv.net. . David . Brooks (Harvard, . USA) Antonio . González (Intel-UPC, .