PPT-Hybrid Pixel R&D and Interconnect Technologies

P Riedler CERN Interconnect Technologies gtgt Talk by Michael Campbell P Riedler ITS upgrade meeting Oct 4 2010 1 Hybrid Pixel Detectors Simplified view Sandwich Sensor Frontendreadout chip. 9 10 11 12 13 12481632 Performance normalized to 1MB LLC size MB 04 06 08 10 0 64 128 192 256 Percore Performance normalized to 1 core Number of cores 64 128 192 256 0 64 128 192 256 Chip Performance normalized to 1 core Number of cores brPage 4br br Jaded Pixel Technologies Inc. is the creator of Shopify, a hosted e-commerce application. Launched to the general public in 2006, Shopify provides the Success story more... Shopify’s Chief Des Kota Yamaguchi, Yoshihiro Watanabe, Takashi . Komuro. , Masatoshi Ishikawa. Outline. Introduction. Problems to apply interleaving. Techniques. Example: Lucas-. Kanade. Conclusion. Purpose. To find a technique to efficiently implement a parallel memory for pixel lookup operations. IPRD13 - 7-10 Oct. 2013, Siena. 1. on behalf of the ATLAS PPS R&D Collaboration. Gianluigi. . Casse. Acknowledgements. : PPS Collaboration Members . PPS’s participating members:. CERN. AS . CR, Prague (Czech Rep.. Proposal. Bob Ross, . Teraspeed. Labs. bob@teraspeedlabs.com. EPEPS 2015 IBIS Summit. San Jose, CA, October 28. , 2015. Draft Presented September 2, 2015 at the Interconnect Working Group. Copyright 2015 . DESIGN. - PROF. RAKESH K. JHA. . CORPORATE . INSTITUTE OF SCIENCE & TECHNOLOGY , BHOPAL. DEPARTMENT OF ELECTRONICS & COMMUNICATIONS . Chips are mostly made of wires called . interconnect.. Wires are as important as transistors. . . DIVYA CHALLA. INTRODUCTION. INTERCONNECTS . connect the electronic circuits on a chip for proper functionality of the IC.. Interconnects can be . Local. . (connections within transistors) or . AXI4-Stream Interconnect v1.1www.xilinx.com PG035 November 18, 2015 Table of ContentsChapter1:OverviewFeature Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . An Open-Source Predictive Process Design Kit for 15nm . FinFET. Technology . Kirti. . Bhanushali. , . . W. . Rhett Davis (NCSU. ). International Symposium on Physical Design. April 1. , 2015. NC STATE . Speaker: Peipei Zhou. Student: Peipei Zhou, Hyunseok Park, Zhenman Fang, . Faculty: Jason Cong, Andre DeHon. II = 1 or not? . A new Question, II vs Energy and II > 1 . II change, what happens?. A case study of MM. . . . Introduction. Crux of a smart pixel array. . . Components of SPA. Packaging of smart pixel arrays. Applications. ,. Advantages & Disadvantages. Seyi. . Ayorinde. Pooja. Paul . Chaudhury. FPGA. 2. Field Programmable Gate Array. Reconfigurable Circuit. Configurable Logic Blocks (CLBs). Calhoun et al.: Flexible Circuits and Architectures for Ultralow Power. Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack. David Mohabir. University of Arizona. March 19. th. , 2012. Testing and diagnosis of interconnect faults in cluster-based FPGA architectures. Section 1. Motivation. Quickly identify faulty components.